EPF6024ATC144-3 vs EPF6010ATC144-3 Comparison
Detailed side-by-side comparison of EPF6024ATC144-3 by Intel and EPF6010ATC144-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6024ATC144-3 | EPF6010ATC144-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | NRND |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 1,960 | — |
| Usable Gates | 24,000 | — |
| Logic Array Blocks (LABs) | 196 | — |
| User I/Os | 117 | — |
| Number of I/O Banks | MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) | — |
| Operating Frequency (max) | 142.86 MHz | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS SRAM |
| Core Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V | — |
| Package | 144-LQFP (TQFP) | — |
| Speed Grade | -3 (mid speed bin) | -3 |
| Operating Temperature | 0 °C to +85 °C (commercial) | — |
| Configuration Interface | JTAG (IEEE 1149.1) + Passive Serial | — |
| Embedded Memory | Embedded Array Blocks (EABs), 2,048 bits each | — |
| RoHS Status | unknown (legacy part) | [DATA_NEEDED: RoHS status] |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL Level] | — |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| System Gates | — | 10,000 |
| Logic Elements / Logic Cells | — | 880 |
| Maximum User I/O | — | 102 |
| Supply Voltage - Operating | — | 3.0 V to 3.6 V |
| Maximum Internal Frequency | — | 142.86 MHz |
| Configuration Memory | — | SRAM (volatile, re-programmable) |
| Programming Interface | — | JTAG (IEEE Std 1149.1) / Serial |
| I/O Standards | — | LVTTL, LVCMOS, PCI compatible; multiVolt I/O |
| Package Type | — | 144-pin TQFP (Fine Line) |
| Pin Pitch | — | 0.5 mm |
| Operating Temperature Grade | — | Commercial / Industrial |