EPF6024ATC144-3 vs EPF6024ATC144-3S Comparison
Detailed side-by-side comparison of EPF6024ATC144-3 by Intel and EPF6024ATC144-3S by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF6024ATC144-3 | EPF6024ATC144-3S |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | Obsolete |
| Family | FLEX 6000 | FLEX 6000 |
| Logic Elements / Cells | 1,960 | — |
| Usable Gates | 24,000 | — |
| Logic Array Blocks (LABs) | 196 | 196 |
| User I/Os | 117 | 117 |
| Number of I/O Banks | MultiVolt I/O (2.5 V / 3.3 V / 5.0 V) | — |
| Operating Frequency (max) | 142.86 MHz | — |
| Process Technology | 0.42 µm CMOS SRAM | 0.42 µm CMOS |
| Core Voltage (VCCINT) | 3.3 V | — |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V | — |
| Package | 144-LQFP (TQFP) | — |
| Speed Grade | -3 (mid speed bin) | — |
| Operating Temperature | 0 °C to +85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | JTAG (IEEE 1149.1) + Passive Serial | — |
| Embedded Memory | Embedded Array Blocks (EABs), 2,048 bits each | — |
| RoHS Status | unknown (legacy part) | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL Level] | — |
| Typical Gates | — | 24,000 |
| Logic Elements (LEs) | — | 1,960 |
| Supply Voltage | — | 3.3 V |
| Internal Frequency | — | 142.86 MHz |
| Configuration Memory | — | SRAM |
| Package Type | — | TQFP-144 (1.0 mm pitch) |
| Terminal Form | — | Gull Wing |
| Package Code | — | LFQFP |
| Programmability | — | In-system via JTAG (ByteBlaster/BitBlaster) |