EPF6024ATC144-3S vs EPF6024ATC144-3 Comparison

Detailed side-by-side comparison of EPF6024ATC144-3S by Intel and EPF6024ATC144-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EPF6024ATC144-3 EPF6024ATC144-3 - 24K Gates FLEX 6000 FPGA, 144-LQFP | Intel

EPF6024ATC144-3 - 24K Gates FLEX 6000 FPGA, 144-LQFP | Intel

EPF6024ATC144-3 ⚠ Last Time Buy

Specification Comparison

Parameter EPF6024ATC144-3S EPF6024ATC144-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family FLEX 6000 FLEX 6000
Typical Gates 24,000 —
Logic Elements (LEs) 1,960 —
Logic Array Blocks (LABs) 196 196
User I/Os 117 117
Supply Voltage 3.3 V —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Internal Frequency 142.86 MHz —
Configuration Memory SRAM —
Package Type TQFP-144 (1.0 mm pitch) —
Operating Temperature [DATA_NEEDED: operating temperature range] 0 °C to +85 °C (commercial)
Mounting Type Surface Mount Surface Mount
Terminal Form Gull Wing —
Package Code LFQFP —
Programmability In-system via JTAG (ByteBlaster/BitBlaster) —
Logic Elements / Cells — 1,960
Usable Gates — 24,000
Number of I/O Banks — MultiVolt I/O (2.5 V / 3.3 V / 5.0 V)
Operating Frequency (max) — 142.86 MHz
Core Voltage (VCCINT) — 3.3 V
I/O Voltage (VCCIO) — 2.5 V / 3.3 V / 5.0 V
Package — 144-LQFP (TQFP)
Speed Grade — -3 (mid speed bin)
Configuration Interface — JTAG (IEEE 1149.1) + Passive Serial
Embedded Memory — Embedded Array Blocks (EABs), 2,048 bits each
RoHS Status — unknown (legacy part)
MSL Level — [DATA_NEEDED: MSL Level]

Datasheets & Resources

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