EPF8282ATC100-2 vs EPF8282ATC100-4 Comparison

Detailed side-by-side comparison of EPF8282ATC100-2 by Intel and EPF8282ATC100-4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8282ATC100-2 EPF8282ATC100-4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Obsolete
Family FLEX 8000 Flex 8000 FPGA
Usable Gates 2,500 2500
Logic Cells 208 —
Logic Array Blocks (LABs) 26 —
User I/Os 78 —
Flip-Flops 282 —
Supply Voltage 5 V 5 V
Process Technology 0.42 µm CMOS —
Package 100-pin TQFP —
Operating Temperature 0 °C to 70 °C (Commercial) 0 C to 70 C
Speed Grade -2 —
Mounting Type Surface Mount Surface Mount
Configuration Memory SRAM (volatile, requires external boot) —
Development Tool Altera MAX+PLUS II —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status - obsolete part]
Series — FLEX 8000
Number of Logic Elements/Cells — 208
Number of LABs/CLBs — 26
Total RAM Bits — [DATA_NEEDED: total embedded memory bits]
Number of I/O — 78
I/O Voltage (MultiVolt) — 3.3 V or 5.0 V
Package / Case — 100-TQFP (LFQFP, S-PQFP-G100)
Pin Count — 100
Terminal Pitch — 0.500 mm
Logic Family — CMOS
Configuration Method — SRAM (serial or parallel EPROM)
Configuration Devices Supported — EPC1, EPC1064, EPC1213, EPC1441
Temperature Grade — Commercial
MSL Level — [DATA_NEEDED: MSL level]

Datasheets & Resources

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