EPF8452ATC100-4 vs EPF8452ATC100-3 Comparison

Detailed side-by-side comparison of EPF8452ATC100-4 by Intel and EPF8452ATC100-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8452ATC100-4 EPF8452ATC100-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Manufacturer Intel (formerly Altera Corporation) —
Series FLEX 8000 —
Device Type FPGA (Field Programmable Gate Array) —
Logic Elements / Cells 336 —
Logic Array Blocks (LABs) 42 42
Usable Gates approximately 4,000 (up to 16,000 across family) 4,000
User I/O Pins 68 —
Number of Pins 100 —
Package Type 100-TQFP (14 x 14 mm, surface mount) —
Supply Voltage (VCCINT) 5 V —
I/O Voltage Support 3.3 V or 5.0 V (MultiVolt I/O) —
Process Technology CMOS SRAM 0.42 µm CMOS SRAM
Configuration Method SRAM, loaded from EPC1 / EPC1213 / EPC1064 / EPC1441 or external EPROM/microcontroller Serial/parallel EPROM, EPC1, EPC1213, EPC1064, EPC1441, or system controller
Speed Grade -4 —
Operating Temperature 0 C to 70 C (Commercial) 0 °C to +70 °C (Commercial)
Logic Family CMOS —
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status - not present in verified web data]
Lead-Free [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Family — FLEX 8000
Logic Elements (LEs) — 336
Flip-Flops / Registers — 452
User I/Os — 78
Supply Voltage — 4.75 V to 5.25 V (5 V nominal)
Internal Operating Frequency — 125 MHz
Package — 100-pin TQFP (14x14 mm)
Mounting Type — Surface Mount
In-Circuit Reconfigurability — Yes (ICR via SRAM)

Datasheets & Resources

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