LFE2-20E-5F672C vs LFE2-20E-6F672C Comparison
Detailed side-by-side comparison of LFE2-20E-5F672C by Lattice Semiconductor and LFE2-20E-6F672C by Lattice Semiconductor. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Lattice Semiconductor
LFE2-20E-5F672C - 21K LUT ECP2 FPGA | Lattice Semiconductor
LFE2-20E-5F672C ✓ ActiveLattice Semiconductor
LFE2-20E-6F672C - 21K LUT ECP2 FPGA, 402 I/O, 672-BBGA | Lattice
LFE2-20E-6F672C ✓ ActiveSpecification Comparison
| Parameter | LFE2-20E-5F672C | LFE2-20E-6F672C |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | ECP2 Field-Programmable Gate Array (FPGA) | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Capacity | 21K LUTs | — |
| I/O Count | 402 I/Os | — |
| DSP Capability | DSP | Integrated DSP multiplier blocks; block count [DATA_NEEDED: DSP block count] |
| Supply Voltage | 1.2 V | — |
| Speed Grade | -5 | -6 |
| Package | 672-BBGA | — |
| Mounting Type | Surface Mount | Surface Mount |
| Number of Logic Cells | [DATA_NEEDED: Number of logic cells] | — |
| Embedded Memory | [DATA_NEEDED: Embedded memory capacity] | [DATA_NEEDED: block RAM capacity] |
| Block RAM | [DATA_NEEDED: Block RAM capacity] | — |
| DSP Multipliers | [DATA_NEEDED: DSP multiplier count] | — |
| Maximum I/O Frequency | [DATA_NEEDED: Maximum I/O frequency] | — |
| Operating Temperature Range | [DATA_NEEDED: Operating temperature range] | — |
| Package Dimensions | [DATA_NEEDED: Package dimensions] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Logic Cells | — | 21,000 cells |
| Look-Up Tables (LUT) | — | 21K LUTs |
| User I/O Count | — | 402 I/O |
| Core Supply Voltage | — | 1.2 V |
| Maximum System Frequency | — | 357 MHz |
| Process Technology | — | 90 nm CMOS |
| Package Type | — | FBGA-672 (BBGA-672) surface-mount ball grid array |
| Package Body Size | — | 27 x 27 mm |
| Number of Terminals | — | 672 balls |
| Package Shape | — | Square |
| Terminal / Ball Form | — | Ball |
| Shipping Form | — | Tray |
| Operating Temperature Grade | — | [DATA_NEEDED: operating temperature range] |
| Lead-Free Status | — | Lead free |
| I/O Standard | — | [DATA_NEEDED: supported I/O standards] |
| Configuration Memory | — | [DATA_NEEDED: configuration interface and memory type] |