LFE2-6E-5F256I vs LFE2-6E-6FN256I Comparison
Detailed side-by-side comparison of LFE2-6E-5F256I by Lattice Semiconductor and LFE2-6E-6FN256I by Lattice Semiconductor. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Lattice Semiconductor
LFE2-6E-6FN256I - 6K LUT FPGA, 190 I/O, 256-BGA | Lattice
LFE2-6E-6FN256I ✓ ActiveSpecification Comparison
| Parameter | LFE2-6E-5F256I | LFE2-6E-6FN256I |
|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | ECP2 Field Programmable Gate Array (FPGA) | ECP2 Field Programmable Gate Array (FPGA) |
| Logic Cells | 6,000 cells | 6,000 cells |
| User I/O | 190 I/O | 190 I/O |
| Configuration Bits | 56,320 bits | — |
| Core Supply | 1.2 V | — |
| Speed Grade | -5 | — |
| Temperature Grade | Industrial | Industrial |
| Package | 256-ball Fine Pitch Ball Grid Array | 256-ball FBGA, 17 mm × 17 mm |
| Package Abbreviation | FPBGA-256 | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Package Shape | Square | Square |
| Terminal Type | Ball | Ball |
| Terminal Count | 256 balls | — |
| Mounting Type | Surface mount | Surface Mount |
| Lead-Free Status | Lead free | Lead free |
| Programmable Logic Type | FPGA | — |
| DSP Support | Advanced DSP blocks supported by the LatticeECP2/M family | — |
| SERDES Support | High-speed SERDES supported by the LatticeECP2M family | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | [DATA_NEEDED: AEC-Q100 qualification status] |
| Logic Blocks | — | 750 LABs |
| Embedded RAM | — | 56,320 bits (67 KB) |
| Maximum Frequency | — | 357 MHz |
| Core Supply Voltage | — | 1.14 V to 1.26 V |
| Nominal Core Voltage | — | 1.2 V |
| Process Technology | — | 90 nm |
| Operating Temperature | — | -40°C to +100°C |
| Package Code | — | FPBGA-256 |
| Number of Terminals | — | 256 balls |
| Standard Packaging | — | Tray |
| Standard Quantity | — | 90 units |