LPC18S30FET256 vs LPC1833JBD144 Comparison

Detailed side-by-side comparison of LPC18S30FET256 by NXP Semiconductors and LPC1833JBD144 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
LPC18S30FET256 LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP

LPC18S30FET256 - 180MHz Cortex-M3 Flashless MCU, 256-LBGA | NXP

LPC18S30FET256 ✓ Active
NXP Semiconductors
LPC1833JBD144 LPC1833JBD144 - 180MHz Cortex-M3 MCU, 512KB Flash, LQFP-144 | NXP

LPC1833JBD144 - 180MHz Cortex-M3 MCU, 512KB Flash, LQFP-144 | NXP

LPC1833JBD144 ✓ Active

Specification Comparison

Parameter LPC18S30FET256 LPC1833JBD144
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.30 $7.20
Core Architecture ARM Cortex-M3 32-bit
Core Width 32-bit —
Maximum Clock Frequency 180 MHz —
On-chip SRAM 200 kB —
On-chip EEPROM 4 kB —
On-chip Flash ROMless (external memory required) —
Package 256-LBGA (17x17 mm) LQFP-144 (20 x 20 mm, 0.5 mm pitch)
Operating Voltage 2.4 V to 3.6 V —
Operating Temperature -40 C to +85 C -40 C to +105 C
HS-USB Controllers 2 (one Host/Peripheral, one Host-only) —
Ethernet MAC 10/100 Mbps with MII/RMII —
External Memory Controller (EMC) Yes (SRAM/SDRAM/NOR/NAND) —
SPIFI (Quad-SPI Flash Interface) Yes —
Hardware AES Decryption Yes —
GPIO Count Up to 165 —
UART / I2C / CAN / SSP 4 / 3 / 2 / 2 —
ADC 10-bit, 8 channels —
MSL Level 3 3 (168 hours)
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Core — ARM Cortex-M3
Maximum CPU Frequency — 180 MHz
Program Flash — 512 kB
SRAM — 136 kB
High-Speed USB 2.0 OTG — 2 (one with on-chip HS PHY)
Ethernet — 10/100 MAC (MII/RMII)
LCD Controller — Yes (STN/TFT)
External Memory Controller — Yes (up to 4 MB address space)
Supply Voltage — 2.4 V to 3.6 V

Datasheets & Resources

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