M1AFS250-1PQ208I vs M1AFS250-2PQG208I Comparison

Detailed side-by-side comparison of M1AFS250-1PQ208I by Microchip Technology and M1AFS250-2PQG208I by Microsemi. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
M1AFS250-1PQ208I M1AFS250-1PQ208I - Fusion FPGA 250K Gates 208-QFP | Microchip

M1AFS250-1PQ208I - Fusion FPGA 250K Gates 208-QFP | Microchip

M1AFS250-1PQ208I ✓ Active
Microsemi
M1AFS250-2PQG208I M1AFS250-2PQG208I - Fusion 250K Mixed-Signal FPGA | Microsemi

M1AFS250-2PQG208I - Fusion 250K Mixed-Signal FPGA | Microsemi

M1AFS250-2PQG208I ✓ Active

Specification Comparison

Parameter M1AFS250-1PQ208I M1AFS250-2PQG208I
Brand Microchip Technology Microsemi
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $47.80 $49.80
Logic Cells (Tiles) 6144 —
Equivalent Gates 250000 —
User I/O 93 —
RAM Bits 36864 —
Family Fusion (M1) Mixed-Signal FPGA Fusion (M1) Mixed-Signal FPGA
Core Voltage 1.5 V —
Technology 130 nm CMOS Flash —
Speed Grade -1 -2
Operating Temperature -40C to +85C (Industrial) —
Package 208-pin PQFP (PQ208 / BFQFP) 208-pin PQFP / BFQFP
Mounting Type Surface Mount Surface Mount
Configuration Memory Flash (non-volatile, single-chip) —
Analog Peripherals Configurable analog blocks (voltage, temperature, current monitoring) Integrated configurable analog block
Clock Management Clock Conditioning Circuits (CCC) —
MSL Level [DATA_NEEDED: MSL Level] —
RoHS Status Compliant (non-Pb PQ208 version is M1AFS250-1PQ208I; PQG208 is Pb-free variant naming) —
Radiation Characteristic Flash-based, immune to configuration upset vs SRAM FPGAs —
System Gates — 250000 gates
User Flash RAM — 36864 bits
Configurable I/O — 93
Core Supply Voltage — 1.5 V (1.425 V to 1.575 V)
Process Technology — 130 nm
Maximum Frequency (distributor listing) — 1470.59 MHz
Configuration Technology — Flash-based (non-volatile, single-chip)
Operating Junction Temperature — -40C to +100C (Industrial)
Terminal Form — Flat (per distributor listing)
On-chip Clock Management — Integrated clock generation and management circuitry
Embedded Memory — Flash memory blocks (large capacity)

Datasheets & Resources

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