M2GL010-1FG484 vs M2GL010-FG484 Comparison
Detailed side-by-side comparison of M2GL010-1FG484 by Microchip Technology and M2GL010-FG484 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M2GL010-1FG484 - 12K LEs, 233 I/O IGLOO2 FPGA | Microchip
M2GL010-1FG484 ✓ ActiveMicrochip Technology
M2GL010-FG484 - 12K LEs, 233 I/O IGLOO2 FPGA | Microchip
M2GL010-FG484 ✓ ActiveSpecification Comparison
| Parameter | M2GL010-1FG484 | M2GL010-FG484 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | IGLOO2 low-density FPGA | IGLOO2 low-density flash FPGA |
| Logic Elements | 12,084 logic elements | — |
| User I/O | 233 I/O | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | Grade 1 | — |
| Temperature Grade | Commercial | — |
| Package Type | 484-ball FBGA | — |
| Package Dimensions | 23 mm × 23 mm × 2.44 mm | — |
| Terminal Count | 484 terminals | — |
| Terminal Form | BGA balls | — |
| Package Shape | Square | — |
| Programming Interface | [DATA_NEEDED: programming interface] | — |
| Programmable Memory Type | [DATA_NEEDED: configuration memory type] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Maximum Clock Frequency | [DATA_NEEDED: maximum clock frequency] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| Block RAM | [DATA_NEEDED: block RAM capacity] | — |
| DSP Resources | [DATA_NEEDED: DSP resource count] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | RoHS non-compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Number of Logic Elements | — | 12,084 LE |
| Total RAM | — | 933,888 bits |
| Number of I/O | — | 233 I/O |
| Supply Voltage Range | — | 1.14 V to 2.625 V |
| Nominal Supply Voltage | — | 1.2 V |
| Package | — | 484-FPBGA (23 mm x 23 mm) |
| Mounting Type | — | Surface mount |
| Operating Temperature | — | 0°C to 85°C (TJ) |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |
| Configuration Memory | — | Flash |
| Series | — | IGLOO2 |
| Logic Density Class | — | 12KLE |
| Terminal Pitch | — | 1.000 mm |
| JESD Package Code | — | S-PBGA-B484 |
| Package Pin Count | — | 484 balls |