M2GL060-VF400I vs M2GL060-VF400 Comparison
Detailed side-by-side comparison of M2GL060-VF400I by Microchip Technology and M2GL060-VF400 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
M2GL060-VF400 - 56.5K LE IGLOO2 FPGA | Microchip Technology
M2GL060-VF400 ✓ ActiveSpecification Comparison
| Parameter | M2GL060-VF400I | M2GL060-VF400 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Product Type | IGLOO2 low-density flash FPGA | — |
| Logic Elements | 56.5K LEs | 56.5K LEs |
| User I/O | 207 I/O | 207 I/O |
| Embedded SRAM | 32 KB | — |
| Core Supply Voltage | 1.2 V | — |
| Package | 400-pin VFBGA, 17 mm x 17 mm | 400-LFBGA |
| Package Ball Pitch | 0.8 mm | — |
| Mounting Type | Surface mount | Surface mount |
| Configuration Technology | Fourth-generation flash-based FPGA fabric | — |
| Product Status | In production | — |
| Communications Interfaces | High-performance communications interfaces | — |
| Embedded Memory | 32 KB embedded SRAM | — |
| On-Chip Configuration Memory | Flash-based configuration storage | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS Compliance | RoHS compliant | [DATA_NEEDED: RoHS compliance status] |
| REACH Compliance | [DATA_NEEDED: REACH compliance status] | [DATA_NEEDED: REACH compliance status] |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Device Type | — | IGLOO2 low-density flash FPGA |
| Total Cells | — | 56,520 cells |
| Supply Voltage | — | 1.2 V |
| Terminal Count | — | 400 terminals |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Programmable Logic | — | Flash-based FPGA |
| Product Family | — | IGLOO2 |
| Lifecycle Status | — | In production |
| Primary Logic Functions | — | Bridging, I/O expansion and conversion, system management, and secure connectivity |
| Target Markets | — | Communications, industrial, medical, defense, and aviation |
| Package Dimensions | — | [DATA_NEEDED: 400-LFBGA body dimensions] |