MC9S08AW48CPUE vs MC9S08AW16CPUE Comparison

Detailed side-by-side comparison of MC9S08AW48CPUE by NXP Semiconductors and MC9S08AW16CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd
NXP Semiconductors
MC9S08AW16CPUE MC9S08AW16CPUE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AW16CPUE - 8-bit S08 MCU, 16KB Flash, 40MHz | NXP

MC9S08AW16CPUE Nrnd

Specification Comparison

Parameter MC9S08AW48CPUE MC9S08AW16CPUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $0.00 $3.20
Core Processor S08 (HCS08) 8-bit CISC S08 (HCS08)
Core Size 8-bit 8-Bit
CPU Speed 40 MHz —
Internal Bus Frequency 20 MHz —
Program Memory Type FLASH FLASH
Program Memory Size 48 KB (48K x 8) 16KB (16K x 8)
RAM Size [DATA_NEEDED: RAM size] 1K x 8
EEPROM Size [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Count 38 —
Package Type 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) —
Package Height 1 mm —
Mounting Type Surface Mount Surface Mount
Operating Temperature [DATA_NEEDED: operating temperature range] -40C to +85C
Debug Interface Single-wire background debug mode (BDM) Single-wire background debug mode (BDM)
Instruction Set HC08 with added BGND instruction HC08 with added BGND instruction
Packaging Tray —
Lifecycle Status NRND (Not Recommended for New Designs) —
RoHS Status [DATA_NEEDED: RoHS status] —
Core Architecture — CISC
Maximum Clock Frequency — 40 MHz (CPU) / 20 MHz (bus)
ADC Resolution — 10-bit
ADC Channels — 16
I/O Ports — 38
Oscillator Type — Internal
Package — 64-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2

Datasheets & Resources

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