MC9S08AW60CFUE vs MC9S08AW32CFUE Comparison
Detailed side-by-side comparison of MC9S08AW60CFUE by NXP Semiconductors and MC9S08AW32CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08AW60CFUE | MC9S08AW32CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8.10 | $7.18 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Frequency | 40 MHz | — |
| Program Memory | 60 KB Flash | 32 KB Flash |
| RAM | 4 KB | 2 KB |
| Core | Enhanced HCS08 8-bit core | S08 (HCS08 enhanced 8-bit) |
| Supply Voltage | 2.7 V to 5.5 V | — |
| Internal Bus Frequency | 20 MHz | — |
| I/O Ports | 38 ports | — |
| Connectivity | I2C, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Package | 64-QFP, 14 x 14 mm | 64-QFP (14x14 mm) |
| Package Height | 1 mm | — |
| Package Pitch | 0.50 mm | — |
| Mounting Style | Surface mount | — |
| Instruction Cycle | 50 ns minimum at 2.7 V and 20 MHz bus | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode interface | BDM (Background Debug Mode) |
| Application Support | Industrial and automotive | — |
| Lifecycle Status | NRND | — |
| Supplier Reference | NXP USA Inc. | — |
| Maximum CPU Frequency | — | 40 MHz |
| Operating Voltage | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, 8-channel |
| Communication Interfaces | — | 2x SCI (UART), 1x SPI, 1x IIC |
| Timers | — | Multiple TPM/MTIM (see datasheet) |
| GPIO | — | Up to 54 |
| Mounting Type | — | Surface Mount |
| Operating Temperature | — | -40C to +85C (industrial) |
| MSL Level | — | 3 |
| RoHS Status | — | Compliant |
| Lead-Free | — | Yes |