MC9S08DV60AMLH vs MC9S08AW32CPUE Comparison
Detailed side-by-side comparison of MC9S08DV60AMLH by NXP Semiconductors and MC9S08AW32CPUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP
MC9S08DV60AMLH ✓ ActiveSpecification Comparison
| Parameter | MC9S08DV60AMLH | MC9S08AW32CPUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.85 | $6.10 |
| Core Processor | S08 (HCS08), 8-bit | S08 |
| Core Size | 8-Bit | 8-Bit |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | — |
| Number of I/O | 53 | — |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | 10-bit |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Supply Voltage | 3.3V/5V | — |
| Package / Case | 64-LQFP (10x10 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 with added BGND instruction |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Package | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Operating Temperature | — | -40C to +85C |
| Lifecycle Status | — | NRND (Not Recommended for New Designs) |
| Family | — | S08AW (AW60/48/32/16) |