MC9S08GT60ACFBE vs MC9S08PA16VTG Comparison

Detailed side-by-side comparison of MC9S08GT60ACFBE by NXP Semiconductors and MC9S08PA16VTG by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08GT60ACFBE MC9S08GT60ACFBE - 8-Bit 40MHz 60KB Flash S08 MCU | NXP

MC9S08GT60ACFBE - 8-Bit 40MHz 60KB Flash S08 MCU | NXP

MC9S08GT60ACFBE Nrnd
NXP Semiconductors
MC9S08PA16VTG MC9S08PA16VTG - 8-bit 20MHz S08 MCU, 16KB Flash | NXP

MC9S08PA16VTG - 8-bit 20MHz S08 MCU, 16KB Flash | NXP

MC9S08PA16VTG Nrnd

Specification Comparison

Parameter MC9S08GT60ACFBE MC9S08PA16VTG
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $9.85 $2.10
Core Architecture HCS08 (enhanced S08) —
CPU Bit Width 8-bit —
Maximum CPU Frequency 40 MHz (20 MHz bus) —
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
I/O Pins 34 —
ADC 8-channel, 10-bit 10-bit, multi-channel
Supply Voltage 1.8 V to 3.6 V —
Communication Interfaces 1x SCI, 1x SPI, 1x I2C —
Timers Multiple TPM channels [DATA_NEEDED: exact channel count] —
Package 44-QFP (10x10 mm) 16-TSSOP (0.173, 4.40 mm Width)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 C to +85 C (industrial) —
Instruction Set CISC, HC08 with BGND —
Interrupt Sources Up to 32 —
Pull-ups Software-selectable on ports —
RoHS Status Compliant —
Core Processor — S08
Core Size — 8-Bit
Maximum CPU Speed — 20 MHz
Program Memory Size — 16 KB (16K x 8)
Program Memory Type — FLASH
RAM Size — 2 KB
EEPROM Size — 256 bytes
Supply Voltage Range — 2.7 V to 5.5 V
Number of I/O — 14
Connectivity — I2C, LINbus, SPI, UART/USART
Peripherals — LVD, POR, PWM, WDT
Operating Temperature Range — -40C to +105C
Lifecycle Status — NRND (Not Recommended for New Designs)

Datasheets & Resources

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