MC9S08PA16VTG vs MC9S08QD4CSC Comparison
Detailed side-by-side comparison of MC9S08PA16VTG by NXP Semiconductors and MC9S08QD4CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08PA16VTG | MC9S08QD4CSC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.10 | $0.00 |
| Core Processor | S08 | S08 (HCS08), 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Maximum CPU Speed | 20 MHz | — |
| Program Memory Size | 16 KB (16K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 2 KB | — |
| EEPROM Size | 256 bytes | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O | 14 | — |
| Connectivity | I2C, LINbus, SPI, UART/USART | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| ADC | 10-bit, multi-channel | — |
| Operating Temperature Range | -40C to +105C | — |
| Package | 16-TSSOP (0.173, 4.40 mm Width) | 8-SOIC |
| Mounting Type | Surface Mount | Surface Mount |
| Lifecycle Status | NRND (Not Recommended for New Designs) | — |
| Maximum Clock Frequency | — | 16 MHz |
| Flash Memory | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| Supply Voltage | — | 3.3 V / 5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 4 |
| General-Purpose I/O | — | 6 |
| Instruction Set | — | HC08 with added BGND instruction |
| Debug Interface | — | Background debugging system (single-wire BDM) |
| Packaging | — | Tube |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Life Cycle Stage | — | End of Life (per NXP product page) |