MC9S08PA4VTG vs MC9S08QE8CWL Comparison

Detailed side-by-side comparison of MC9S08PA4VTG by NXP Semiconductors and MC9S08QE8CWL by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter MC9S08PA4VTG MC9S08QE8CWL
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Core Processor S08 HCS08 (S08)
Core Size 8-Bit 8-bit
Maximum Bus Speed 20 MHz —
Program Memory Size 4 KB (4K x 8) FLASH —
EEPROM Size 128 x 8 (128 bytes) —
RAM Size [DATA_NEEDED: RAM size] —
Operating Voltage Range 2.7 V to 5.5 V —
Number of I/O 14 —
Package 16-TSSOP (VTG) - 4.4 mm body 28-pin SOIC W (7 mm x 7 mm, 1.40 mm height, 0.80 mm pitch)
Connectivity LINbus, SPI, UART/USART I2C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT LVD, PWM, 16-bit Timer (TPM), BDM
Data Converters [DATA_NEEDED: ADC channels/bits] —
Oscillator Type Internal (FLL-stabilized) —
Operating Temperature -40 °C to +125 °C (automotive) -40 C to +85 C
Mounting Type Surface Mount Surface Mount
MSL Level [DATA_NEEDED: MSL level] —
Lead-Free / RoHS Lead free / RoHS compliant —
AEC-Q100 Qualified (automotive grade) —
Core Architecture — CISC, Harvard, 3-stage pipeline
Maximum CPU Frequency — 20 MHz at 1.8 V; 50.33 MHz bus at 2.1 V
Program Memory (Flash) — 8 KB (8K x 8)
RAM — 512 B
Supply Voltage (VDD) — 1.8 V to 3.6 V
I/O Pins — 28
PWM Channels — Up to 6
Debug Interface — Single-wire Background Debug Mode (BDM)
ROM Type — Flash
RoHS Status — Compliant (per NXP product page)
Series — S08QE Flexis
Mounting Style — Surface Mount
Family — MC9S08

Datasheets & Resources

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