MC9S08QD2VPC vs MC9S08QD4VPC Comparison
Detailed side-by-side comparison of MC9S08QD2VPC by NXP Semiconductors and MC9S08QD4VPC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S08QD4VPC - 8-bit S08 MCU, 4KB Flash, 16MHz, DIP-8 | NXP
MC9S08QD4VPC ✓ ActiveSpecification Comparison
| Parameter | MC9S08QD2VPC | MC9S08QD4VPC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Product Type | 8-bit S08 microcontroller | — |
| CPU Architecture | CISC | — |
| Maximum CPU Frequency | 16 MHz | 16 MHz (8 MHz bus) |
| Bus Frequency | 8 MHz | — |
| Internal Flash Memory | 2 KB (2K x 8) | — |
| Memory Configuration | 128 x 8 | — |
| Operating Supply Voltage | 2.7 V to 5.5 V | — |
| Nominal Supply Levels | 3.3 V / 5 V | — |
| Package | 8-pin PDIP | 8-pin PDIP (DIP-8, 0.300 inch / 7.62 mm) |
| Mounting Type | Through-hole | Through-hole (DIP) |
| Packaging | Tube | — |
| Program Memory Type | Flash | — |
| General-Purpose I/O Count | [DATA_NEEDED: general-purpose I/O count] | — |
| RAM Capacity | [DATA_NEEDED: RAM capacity] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution] | — |
| Timer Configuration | [DATA_NEEDED: timer configuration] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status from datasheet] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Core | — | S08 (HCS08) 8-bit CPU |
| Instruction Set | — | HC08 with added BGND |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 bytes |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| GPIO Pins | — | 6 |
| ADC | — | 4-channel, 10-bit |
| Timers | — | MTIM and TPM (per datasheet) |
| Communication Interfaces | — | SCI (UART), I2C multimaster |
| Debug Interface | — | Background Debug Mode (BDM), 3 breakpoints |
| Operating Temperature | — | -40 C to +85 C (industrial, typical) |
| MSL Level | — | [DATA_NEEDED: MSL level for DIP-8] |