MC9S08QD2VSC vs MC9S08QA2CDNE Comparison

Detailed side-by-side comparison of MC9S08QD2VSC by NXP Semiconductors and MC9S08QA2CDNE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S08QD2VSC MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC - 8-bit S08 MCU, 2KB Flash, 16MHz, SOIC-8 | NXP

MC9S08QD2VSC ✓ Active
NXP Semiconductors
MC9S08QA2CDNE MC9S08QA2CDNE - 8-Bit 20MHz 2KB Flash MCU | NXP 8-SOIC

MC9S08QA2CDNE - 8-Bit 20MHz 2KB Flash MCU | NXP 8-SOIC

MC9S08QA2CDNE ✗ End of Life

Specification Comparison

Parameter MC9S08QD2VSC MC9S08QA2CDNE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Stock Status In Stock In Stock
Unit Price (USD) $0.81 $0.95
Core Architecture HCS08 (enhanced HC08) —
Program Memory (Flash) 2 KB (2K x 8) —
RAM 256 bytes —
CPU Clock (max) 16 MHz —
Operating Voltage 2.7 V to 5.5 V —
ADC 4-channel, 10-bit —
GPIO Pins 6 —
Timers [DATA_NEEDED: timer module count] —
Communication Peripherals [DATA_NEEDED: SCI/SPI/I2C configuration] —
Package 8-SOIC (SO-8) 8-pin SOIC
Mounting Type Surface Mount Surface Mount
MSL Level 3 (168 hours) [DATA_NEEDED: confirm from datasheet]
Operating Temperature -40 C to +85 C (V suffix = industrial) -40C to +85C [DATA_NEEDED: confirm from datasheet]
RoHS Status Compliant [DATA_NEEDED: confirm from datasheet]
Debug Interface Background Debug Mode (BDM) —
Internal Oscillator Yes (factory trimmed) —
Core — HCS08 (S08)
Data Bus Width — 8 bit
Instruction Set — HC08 + BGND
Maximum Clock Frequency — 20 MHz
Core Speed — 40 MHz
Program Memory Size — 2 KB (2K x 8) Flash
Supply Voltage Range — 1.8 V to 3.3 V (3.6 V abs max)
Low-Power Modes — Two very low-power stop modes
Low-Voltage Detection — Yes (reset or interrupt)
Background Debug — BDCS with breakpoint capability

Datasheets & Resources

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