MC9S08QG4CDTE vs MC9S08QG4CPAE Comparison
Detailed side-by-side comparison of MC9S08QG4CDTE by NXP Semiconductors and MC9S08QG4CPAE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S08QG4CDTE | MC9S08QG4CPAE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2.76 | $1.71 |
| Product Type | 8-bit S08 CISC microcontroller | — |
| CPU Clock | 20 MHz | — |
| Program Memory | 4 KB flash | — |
| Program Memory Organization | 4K x 8 bits | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Architecture | HCS08 enhanced 8-bit core | — |
| Instruction Set | HC08 instruction set with BGND instruction | — |
| I/O Port Count | 6 | — |
| Package | 16-TSSOP | 8-pin PDIP (CPAE) |
| Mounting Type | Surface mount | Through-Hole |
| Debug Support | Background debugging system with single breakpoint capability | — |
| Product Family | S08QG | — |
| Core Category | 8-bit microcontroller | — |
| Application Category | Low-power embedded control | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40 C to +85 C (industrial) |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Core Architecture | — | HCS08 (8-bit, enhanced HC08 core) |
| Maximum CPU Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 B |
| I/O Pins | — | 6 |
| ADC | — | 10-bit, 4-channel |
| Debug Interface | — | Background Debug Controller (BDC), single breakpoint |
| Internal Clock | — | Yes (ICS with FLL, often removes need for external crystal) |
| Timers | — | TPM (Timer/PWM Module) |
| Communication | — | SCI (UART), optional I2C(2) |