MC9S12B64CFUE vs MC9S12B128CFUE Comparison

Detailed side-by-side comparison of MC9S12B64CFUE by NXP Semiconductors and MC9S12B128CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12B64CFUE MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP

MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP

MC9S12B64CFUE ⚠ Last Time Buy
NXP Semiconductors
MC9S12B128CFUE MC9S12B128CFUE - 16-bit S12 MCU, 128KB Flash, 25MHz | NXP

MC9S12B128CFUE - 16-bit S12 MCU, 128KB Flash, 25MHz | NXP

MC9S12B128CFUE ✓ Active

Specification Comparison

Parameter MC9S12B64CFUE MC9S12B128CFUE
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Active
Stock Status In Stock In Stock
Unit Price (USD) $10.10 $14.85
Core HCS12 (S12 CISC, 16-bit) HCS12 (S12B)
Flash Memory 64 KB —
RAM 2 KB —
EEPROM 1 KB —
Maximum CPU Frequency 25 MHz —
Supply Voltage 5 V (typical) —
Operating Temperature Range 0C to +70C (commercial 'C' grade) -40C to +85C
Package 80-QFP (14x14 mm) 80-LQFP (14x14 mm)
Mounting Type Surface Mount Surface Mount
ADC 8-channel, 10-bit 8-channel, 10-bit
CAN Module 1x MSCAN 2.0A/B MSCAN (CAN 2.0 A/B)
SCI/SPI 2x SCI, 1x SPI —
Timers 16-bit Timer + 8-bit PWM + PIT —
I/O Pins [DATA_NEEDED: I/O pin count] —
Debug Interface Background Debug Mode (BDM) BDM (Background Debug Mode)
RoHS Status Compliant Compliant
Lead-Free / Terminal Finish Matte Tin (Sn) —
Peak Reflow Temperature 260C (max 40 s) —
Data Bus Width — 16 bit
Maximum Clock Frequency — 25 MHz
Program Memory Size — 128 KB Flash
RAM Size — 8 KB
EEPROM Size — 4 KB
Supply Voltage Range — 5 V typical (4.5 V to 5.5 V)
PWM Channels — 8
SCI / SPI — 3 x SCI, 2 x SPI
GPIO Count — 59 (maximum)
On-chip Oscillator — Yes (PLL with internal reference)

Datasheets & Resources

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