MC9S12B64MFUE vs MC9S12D64CFUE Comparison
Detailed side-by-side comparison of MC9S12B64MFUE by NXP Semiconductors and MC9S12D64CFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S12B64MFUE | MC9S12D64CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.10 | $16.20 |
| Series | HCS12 | — |
| Core | HCS12 (CISC) | HCS12 (16-bit CISC) |
| Data Bus Width | 16-bit | — |
| Maximum Clock Frequency | 25 MHz | — |
| Program Memory Size (Flash) | 64 KB (64K x 8) | — |
| RAM Size | 2 KB | — |
| Supply Voltage | 5 V | 2.5 V / 5 V |
| Package | 80-QFP (14 x 14 mm) | 80-QFP (14 x 14 mm) |
| Pin Count | 80 | — |
| Mounting Type | Surface Mount | Surface Mount |
| Communication Interfaces | CAN, SCI (UART), SPI | — |
| A/D Channels | [DATA_NEEDED: A/D channel count] | — |
| A/D Resolution | [DATA_NEEDED: A/D resolution] | — |
| Timers | [DATA_NEEDED: timer module count] | ECT, TIM, PWM, PIT |
| PWM Channels | [DATA_NEEDED: PWM channel count] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| RoHS Status | RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free / Lead Content | [DATA_NEEDED: lead-free status] | — |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| RAM | — | 4 KB |
| EEPROM | — | 1 KB |
| Number of I/O | — | 59 |
| ADC | — | 8-channel, 10-bit |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |