MC9S12D64VFU vs MC9S12D64VFUE Comparison
Detailed side-by-side comparison of MC9S12D64VFU by NXP Semiconductors and MC9S12D64VFUE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | MC9S12D64VFU | MC9S12D64VFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Product Type | 16-bit HCS12 automotive microcontroller | — |
| Manufacturer | NXP Semiconductors | — |
| Maximum CPU Frequency | 25 MHz | — |
| CPU Architecture | 16-bit CISC | — |
| Core | HCS12 | — |
| Flash Memory | 64 KB | 64KB (64K x 8) |
| Program Memory Organization | 64K x 8 bits | — |
| Supply Voltage | 2.5 V or 5 V | 2.5V / 5V |
| Package | 80-QFP | 80-QFP (14x14 mm) |
| Package Dimensions | 14 mm x 14 mm | — |
| Terminal Count | 80 pins | — |
| Lead Form | Gull wing | — |
| Package Shape | Square | — |
| Mounting Type | Surface mount | Surface Mount |
| Temperature Grade | Industrial | — |
| Automotive Qualification | AEC-Q100 qualified | — |
| RAM Memory | [DATA_NEEDED: RAM memory size] | — |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Core Processor | — | HCS12 |
| Core Architecture | — | 16-bit CISC |
| Core Size | — | 16-bit |
| Maximum Clock Frequency | — | 25 MHz |
| RAM Size | — | [DATA_NEEDED: SRAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| Peripherals | — | [DATA_NEEDED: peripheral list (CAN, SCI, SPI, ADC, PWM)] |
| Connectivity | — | [DATA_NEEDED: connectivity interfaces] |
| Program Memory Type | — | FLASH |
| Supplier Device Package | — | 80-QFP |
| Base Product Number | — | MC9S12D64 |
| Family Series | — | S12D (MC9S12D-Family) |
| Packaging | — | Tray |
| Application Target | — | Automotive multiplexing |