MC9S12DJ256CPV vs MC9S12XEQ384CAG Comparison

Detailed side-by-side comparison of MC9S12DJ256CPV by NXP Semiconductors and MC9S12XEQ384CAG by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12DJ256CPV MC9S12DJ256CPV - 16-bit 256KB Flash HCS12 MCU | NXP 112-LQFP

MC9S12DJ256CPV - 16-bit 256KB Flash HCS12 MCU | NXP 112-LQFP

MC9S12DJ256CPV ✓ Active
NXP Semiconductors
MC9S12XEQ384CAG MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG ✓ Active

Specification Comparison

Parameter MC9S12DJ256CPV MC9S12XEQ384CAG
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $11.78 $0.00
Core HCS12 CPU12 (16-bit CISC) —
Maximum CPU Clock 25 MHz —
Program Memory (Flash) 256 KB —
Data Memory (RAM) 12 KB —
EEPROM 4 KB Hardware-emulated EEPROM (programmable, flexible)
Supply Voltage 5 V [DATA_NEEDED: Supply Voltage]
Operating Temperature -40C to +85C (industrial) -40C to +85C (TA)
CAN Modules 2 x CAN 2.0A/B —
SCI Modules 2 x SCI (UART) —
SPI Modules 2 x SPI —
IIC Module 1 x IIC (Inter-IC Bus) —
ADC 8-channel 10-bit —
Enhanced Capture Timer 8-channel (IC/OC/PWM) —
GPIO Up to 20 discrete digital I/O lines —
Package 112-pin LQFP (20x20 mm) 144-LQFP (20x20 mm)
Mounting Type Surface Mount (Gull Wing) Surface Mount
AEC-Q100 Qualification Yes (automotive grade) —
Background Debug Mode (BDM) Yes —
Core Processor — HCS12X (16-bit CISC)
Core Size — 16-bit
Bus Speed — 50 MHz
Co-processor — XGATE RISC co-processor
Flash Memory — 384 KB (384K x 8)
RAM Size — 24K x 8
ADC Resolution — 12-bit
ADC Conversion Time — 3 us
Timers — Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Memory Protection — MPU with supervisor/user modes
I/O Ports — [DATA_NEEDED: I/O Ports count]
Packaging — Tray
Lifecycle Stage — Active

Datasheets & Resources

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