MC9S12DT256VPVE vs MC9S12E256MPVE Comparison
Detailed side-by-side comparison of MC9S12DT256VPVE by NXP Semiconductors and MC9S12E256MPVE by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE Nrnd
Specification Comparison
| Parameter | MC9S12DT256VPVE | MC9S12E256MPVE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $25.87 | $18.20 |
| Core | HCS12 (16-bit CISC) | HCS12 |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | 16 KB |
| EEPROM | 4 KB | — |
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 | 6 |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant (verify per lot) | — |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| MSL Level | [DATA_NEEDED: MSL Level] | — |
| Lead-Free | Yes | — |
| Core Size | — | 16-bit |
| Maximum CPU Speed | — | 25 MHz |
| Program Memory | — | 256 KB Flash |
| Pin Count | — | 112 |
| Supply Voltage | — | 5 V single rail (Vreg internal) |
| SCI Modules | — | 3 (asynchronous serial) |
| SPI Modules | — | 1 |
| IIC Modules | — | 1 (Inter-IC Bus) |
| Timer Modules | — | 3 x 16-bit, 4-channel |
| Connectivity | — | EBI/EMI, I2C, SPI, SCI |
| Operating Temperature | — | [DATA_NEEDED: operating temperature range] |
| RoHS | — | [DATA_NEEDED: RoHS status] |