MC9S12GC64CFAE vs S9S12B96F0CFUER Comparison

Detailed side-by-side comparison of MC9S12GC64CFAE by NXP Semiconductors and S9S12B96F0CFUER by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MC9S12GC64CFAE MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP

MC9S12GC64CFAE - 16-Bit HCS12 MCU, 64KB Flash, 48-LQFP | NXP

MC9S12GC64CFAE Nrnd
NXP Semiconductors
S9S12B96F0CFUER S9S12B96F0CFUER - 16-bit 96MHz S12 MCU, 96KB, Automotive LQFP-80 | NXP

S9S12B96F0CFUER - 16-bit 96MHz S12 MCU, 96KB, Automotive LQFP-80 | NXP

S9S12B96F0CFUER ✓ Active

Specification Comparison

Parameter MC9S12GC64CFAE S9S12B96F0CFUER
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $4.41 $11.50
Core Architecture HCS12 (16-bit) —
Program Memory (Flash) 64 KB (64K x 8) —
RAM 4 KB [DATA_NEEDED: RAM size in KB]
EEPROM 1 KB —
Maximum CPU Frequency 25 MHz —
External Supply Range 2.97 V to 5.5 V —
Internal Voltage Regulator On-chip bandgap-based Vreg —
Package 48-LQFP (7x7 mm) LQFP-80 (FUE)
Mounting Type Surface Mount Surface Mount
CAN Controller CAN 2.0 A/B (1 module) —
Serial Interfaces SCI, SPI —
ADC 10-bit, 8 channels —
Timers TIM/PWM/Input-Capture/Output-Compare —
Operating Temperature -40C to +85C —
PLL On-chip (crystal-derived bus clock) —
Debug Interface Background Debug Mode (BDM) —
MSL Level [DATA_NEEDED: MSL Level] 3
RoHS Status Compliant Compliant
Core — S12 (16-bit CISC)
CPU Maximum Frequency — 25 MHz
Flash Memory — [DATA_NEEDED: Flash size in KB]
Pin Count — 80
Operating Temperature Range — -40C to +85C
Automotive Qualified — Yes
Peak Reflow Temperature — 260 C
Maximum Time At Peak Reflow Temperature — 40 s
Terminal Finish — TIN
JESD-609 Code — e3

Datasheets & Resources

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