MC9S12XA512CAL vs MC9S12XDP512VAL Comparison
Detailed side-by-side comparison of MC9S12XA512CAL by NXP Semiconductors and MC9S12XDP512VAL by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MC9S12XDP512VAL - 16-bit 80MHz HCS12X MCU 512KB Flash | NXP
MC9S12XDP512VAL ✓ ActiveSpecification Comparison
| Parameter | MC9S12XA512CAL | MC9S12XDP512VAL |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | NRND | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $9.10 | $11.10 |
| Core | HCS12X (enhanced HCS12, CISC) | — |
| Maximum CPU Frequency | 80 MHz | 80 MHz |
| Internal Bus Frequency | 40 MHz | — |
| Program Flash | 512 KB (512K x 8) | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Data Bus Width | 16-bit | — |
| ADC | 16-channel, 10-bit | 8/10-bit ATD (S12ATD10B8CV3) |
| General-Purpose I/O | Up to 91 | — |
| Communication Interfaces | CAN (MSCAN), SCI, SPI, IIC | — |
| Operating Voltage | 2.5 V / 5 V | — |
| Operating Temperature | -40C to +85C (industrial) | [DATA_NEEDED: automotive -40C to +105C or -40C to +125C grade] |
| Package | 112-LQFP (20x20 mm) | — |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Architecture | — | 16-bit CISC |
| Program Memory Size | — | 512 KB (512K x 8) Flash |
| RAM Size | — | [DATA_NEEDED: RAM size in KB] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM emulation size] |
| Supply Voltage | — | 2.35 V to 2.75 V |
| I/O Pins | — | 119 |
| Package Type | — | 112-pin LQFP (20 x 20 mm) |
| CAN Modules | — | Multiple MSCAN (CAN 2.0A/B) |
| Co-processor | — | XGATE |
| Instruction Set Compatibility | — | Upward-compatible with HCS12 |
| ROM Type | — | Flash |
| Lifecycle Status | — | Active |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance] |