MCF5329CVM240 vs MCF5307CAI66B Comparison

Detailed side-by-side comparison of MCF5329CVM240 by NXP Semiconductors and MCF5307CAI66B by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd
NXP Semiconductors
MCF5307CAI66B MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B ⚠ Last Time Buy

Specification Comparison

Parameter MCF5329CVM240 MCF5307CAI66B
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Last Time Buy
Stock Status In Stock In Stock
Unit Price (USD) $25.60 $34.80
Core Architecture ColdFire V3 (VLRISC) —
Core Bit Width 32-bit —
Maximum Clock Frequency 240 MHz 66 MHz
On-chip SRAM 32 KB 4 KB
Unified Cache 16 KB write-back —
Program Memory Type ROMless (external memory bus required) —
Number of I/O Lines 94 —
Package 256-LBGA (MAPBGA) 208-FQFP (28x28 mm)
Mounting Type Surface Mount Surface Mount
Supply Voltage 1.5 V core / 3.3 V I/O (typical, refer to datasheet) 3.3 V
Operating Temperature -40C to +85C (industrial) -40C to +85C
Oscillator Type External —
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire) —
Ethernet 10/100 MAC integrated —
USB USB 2.0 Full-Speed OTG —
Debug Interface JTAG/BDM/OnCE —
Packaging Tray —
RoHS Status Compliant Compliant
Core — ColdFire V3
Data Bus Width — 32 bit
Performance — 70 MIPS
Instruction Set Architecture — ColdFire (variable-length RISC, 68k-derived)
On-chip ROM — ROMless
MAC Unit — Yes (integrated multiply-accumulate)
DRAM Controller — Yes (integrated)
DMA Controller — Yes
UART — 2
Process Node — 0.35 um
Tray Quantity — Per manufacturer tray standard

Datasheets & Resources

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