MCF5329CVM240 vs MCF5329CVM240J Comparison

Detailed side-by-side comparison of MCF5329CVM240 by NXP Semiconductors and MCF5329CVM240J by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MCF5329CVM240 MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 - ColdFire V3 MPU, 240MHz, 256-LBGA | NXP

MCF5329CVM240 Nrnd

Specification Comparison

Parameter MCF5329CVM240 MCF5329CVM240J
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND Active
Stock Status In Stock In Stock
Unit Price (USD) $25.60 $25.95
Core Architecture ColdFire V3 (VLRISC) ColdFire V3 (Version 3) variable-length RISC
Core Bit Width 32-bit —
Maximum Clock Frequency 240 MHz 240 MHz
On-chip SRAM 32 KB [DATA_NEEDED: on-chip SRAM size]
Unified Cache 16 KB write-back —
Program Memory Type ROMless (external memory bus required) ROMless (external flash required)
Number of I/O Lines 94 —
Package 256-LBGA (MAPBGA) 256-MAPBGA 17 mm × 17 mm, 1.0 mm pitch
Mounting Type Surface Mount Surface Mount (BGA)
Supply Voltage 1.5 V core / 3.3 V I/O (typical, refer to datasheet) [DATA_NEEDED: core I/O supply voltage]
Operating Temperature -40C to +85C (industrial) [DATA_NEEDED: operating temperature range]
Oscillator Type External —
LCD Controller Integrated (TFT/STN, first integrated LCD on ColdFire) —
Ethernet 10/100 MAC integrated Integrated Fast Ethernet MAC (10/100)
USB USB 2.0 Full-Speed OTG USB On-The-Go (OTG) controller
Debug Interface JTAG/BDM/OnCE —
Packaging Tray —
RoHS Status Compliant ROHS3 Compliant
Data Bus Width — 32 bit
SD Host Controller — eSDHC (enhanced SDHC)
CAN — FlexCAN
Serial Interfaces — UART, SPI, I2C
External Memory Support — DDR SDRAM, NAND flash, NOR flash, SRAM
JTAG Debug — Yes (IEEE 1149.1 boundary-scan + BDM)
Processor Series — MCF532xx

Datasheets & Resources

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