MK60DN512ZVLQ10 vs MK60DN512ZVMD10 Comparison

Detailed side-by-side comparison of MK60DN512ZVLQ10 by NXP Semiconductors and MK60DN512ZVMD10 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MK60DN512ZVLQ10 MK60DN512ZVLQ10 - K60 100MHz Cortex-M4 MCU, 512KB Flash | NXP

MK60DN512ZVLQ10 - K60 100MHz Cortex-M4 MCU, 512KB Flash | NXP

MK60DN512ZVLQ10 Nrnd

Specification Comparison

Parameter MK60DN512ZVLQ10 MK60DN512ZVMD10
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND NRND
Stock Status In Stock In Stock
Unit Price (USD) $9.30 $14.81
Core Architecture ARM Cortex-M4 with FPU and DSP ARM Cortex-M4 with FPU and DSP instructions
Maximum CPU Frequency 100 MHz 100 MHz
Program Flash Memory 512 KB 512 KB (512K x 8)
SRAM 128 KB 128 KB
Supply Voltage Range 1.71 V to 3.6 V 1.71 V to 3.6 V
Operating Temperature Range -40 C to +105 C -40C to +105C (industrial extended)
Package Type 144-LQFP (20x20 mm) —
Ethernet MAC 10/100 Mbps with IEEE 1588 10/100 Mbps with IEEE 1588 timestamping
USB Controller USB 2.0 Full-Speed, Device/Host/OTG —
CAN Modules 1 x CAN —
ADC 16-bit, multiple channels Dual 16-bit SAR, up to 4 Msps
DAC 12-bit 12-bit
Timers Multiple FTM, PIT, LPTMR, RTC —
Communication Peripherals UART, SPI, I2C, I2S —
LCD Controller Yes (segment and dot-matrix) —
Pin Count 144 —
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level 3 (per JEDEC J-STD-020) 3 (per JEDEC J-STD-020)
RoHS Status Compliant Compliant
Package — 144-pin MAP-BGA (13 x 13 mm, 0.8 mm pitch)
USB — USB 2.0 Full-Speed OTG with on-chip transceiver
Hardware Cryptography — AES, DES, 3DES, MD5, SHA-1, SHA-256, TRNG
CAN — FlexCAN (CAN 2.0B)
GPIO — Up to 100 (multiplexed)
External Memory Bus — 16-bit, supports SDRAM and NAND/NOR Flash
Low-Power Modes — Wait, Stop, VLPR, VLPW, VLLS

Datasheets & Resources

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