MKE02Z64VLD2 vs S9S08AW16AE0VLD Comparison
Detailed side-by-side comparison of MKE02Z64VLD2 by NXP Semiconductors and S9S08AW16AE0VLD by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MKE02Z64VLD2 - 20MHz Cortex-M0+ MCU, 64KB Flash, 44-LQFP | NXP
MKE02Z64VLD2 ✓ ActiveNXP Semiconductors
S9S08AW16AE0VLD - 8-bit MCU, 16KB Flash, 40MHz, Auto QFP-44 | NXP
S9S08AW16AE0VLD ⚠ Last Time BuySpecification Comparison
| Parameter | MKE02Z64VLD2 | S9S08AW16AE0VLD |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Last Time Buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $3.62 | $4.92 |
| Core Processor | ARM Cortex-M0+ | — |
| Core Size | 32-Bit | — |
| Core Count | Single-Core | — |
| CPU Speed | 20 MHz | — |
| Program Memory Size | 64 KB (64K x 8) FLASH | — |
| RAM Size | 4 KB | — |
| Program Memory Type | FLASH | — |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Supply Voltage (3.3V / 5V) | 3.3V / 5V dual-rail support | — |
| Package | 44-LQFP (10x10 mm) | 44-LQFP (10x10 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| Flash Write Voltage Range | 2.7 V to 5.5 V | — |
| Power Modes | Run, Wait, Stop | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40 °C to +105 °C (Automotive Grade) |
| Series | Kinetis KE02 sub-family | — |
| Family Compatibility | Pin-compatible with Kinetis E series and Freescale S08P | — |
| Core Architecture | — | HCS08 (8-bit CISC) |
| CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 1 KB |
| Operating Voltage | — | 2.7 V to 5.5 V |
| ADC | — | [DATA_NEEDED: ADC resolution and channel count] |
| Timers | — | [DATA_NEEDED: timer module count] |
| Communication Interfaces | — | SCI (UART), SPI |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| Breakpoint Capability | — | Single breakpoint during in-circuit debugging |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Automotive Qualification | — | Yes (AEC-Q100 grade implied by -40/+105 °C range and S9 prefix) |
| RoHS Status | — | Compliant |
| MSL Level | — | [DATA_NEEDED: MSL level] |