MPC8306SVMABDCA vs MPC8306VMABDCA Comparison
Detailed side-by-side comparison of MPC8306SVMABDCA by NXP Semiconductors and MPC8306VMABDCA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ Last Time BuyNXP Semiconductors
MPC8306VMABDCA - PowerQUICC II Pro SoC, e300, 133MHz | NXP
MPC8306VMABDCA ✗ End of LifeSpecification Comparison
| Parameter | MPC8306SVMABDCA | MPC8306VMABDCA |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Last Time Buy | End of Life |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.00 | $16.10 |
| Core Architecture | PowerPC e300c3 (Power Architecture) | — |
| Core Count | 1 | — |
| Data Bus Width | 32-bit | 32 bit |
| Core Frequency | 133 MHz | 133 MHz |
| Memory Controller | DDR2 up to 333 MHz data rate | DDR2 with ECC |
| On-chip Cache | 32 KB instruction / 32 KB data | — |
| Ethernet | Dual 10/100 MAC with MII/RMII | 2x 10/100 MAC with R/MII, IEEE 1588 v2 |
| USB | USB 2.0 Full-Speed | USB 2.0 Full-Speed |
| Connectivity | QUICC Engine (HDLC, TDM), 2x UART | — |
| Package | 369-MAPBGA (19x19 mm, 0.8 mm pitch) | 369-LFBGA (19x19 mm) |
| Operating Temperature | 0C to +105C | 0 °C to +105 °C |
| Supply Voltage | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O | — |
| RoHS Status | Compliant (lead-free) | [DATA_NEEDED: rohs status] |
| Lead-Free | Yes | — |
| MSL Level | [DATA_NEEDED: MSL level] | — |
| Core Processor | — | PowerPC e300c3 |
| Number of Cores | — | 1 |
| Co-Processor / DSP | — | QUICC Engine (communications offload) |
| CAN | — | CAN 2.0 |
| Serial Protocols | — | HDLC, TDM (time-slot) |
| Graphics Acceleration | — | No |
| Mounting Type | — | Surface Mount (BGA) |
| Series | — | MPC83xx / PowerQUICC II Pro |