MPC8349EVVAJFB vs MPC8347VVAJDB Comparison

Detailed side-by-side comparison of MPC8349EVVAJFB by NXP Semiconductors and MPC8347VVAJDB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8349EVVAJFB MPC8349EVVAJFB - PowerQUICC II Pro 533MHz e300 MPU | NXP

MPC8349EVVAJFB - PowerQUICC II Pro 533MHz e300 MPU | NXP

MPC8349EVVAJFB Nrnd
NXP Semiconductors
MPC8347VVAJDB MPC8347VVAJDB - PowerQUICC II Pro MPU, 533MHz, 672-TBGA | NXP

MPC8347VVAJDB - PowerQUICC II Pro MPU, 533MHz, 672-TBGA | NXP

MPC8347VVAJDB ✗ End of Life

Specification Comparison

Parameter MPC8349EVVAJFB MPC8347VVAJDB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status NRND End of Life
Stock Status In Stock In Stock
Unit Price (USD) $56.90 $58.95
Manufacturer NXP Semiconductors NXP USA Inc.
Series PowerQUICC II Pro (MPC83xx) MPC8347E PowerQUICC II Pro
Core Processor PowerPC e300 PowerPC e300
Core Architecture 32-bit PowerPC —
Number of Cores 1 —
Core Frequency 533 MHz —
L1 Cache (Instruction) 32 KB —
L1 Cache (Data) 32 KB —
Operating Temperature 0C to 105C (TA) 0C to +105C
Core Voltage Range 1.14 V to 1.26 V —
I/O Voltage 1.8 V / 2.5 V / 3.3 V 1.8V / 2.5V / 3.3V (mixed)
Package / Case 672-LBGA (TBGA, 35x35 mm) 672-TBGA (35x35 mm)
Mounting Type Surface Mount Surface Mount
Supplier Device Package 672-LBGA (35x35) —
Ethernet 1x 10/100/1000 MbE MAC 10/100/1000 (1 Gbps)
PCI 2x PCI (one 32-bit/66 MHz, one 32-bit/33 MHz) —
Memory Controller DDR1 / DDR2 up to 266 MHz DDR1 / DDR2 up to 333 MHz
USB USB 2.0 full/low speed USB 2.0 Full-Speed
Security Engine SEC 2.0 with RNG (DES/3DES/AES/SHA/MD5/RSA) Not present (non-E variant)
Additional Interfaces DUART, I2C, SPI, Local Bus —
Lead-Free / RoHS Lead-free, RoHS compliant —
Packaging Tray —
MPN — MPC8347VVAJDB
Number of Cores / Bus Width — 1 Core / 32-Bit
Core Speed — 533 MHz
PCI Interface — 32-bit PCI 2.3
Process Technology — 0.13 um CMOS
Tray Quantity — Per TBGA tray specification
RoHS Status — Compliant
Lifecycle — End of Life (EOL) per NXP product page

Datasheets & Resources

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