MPC8358ECVRAGDDA vs MPC8358EZQAGDDA Comparison

Detailed side-by-side comparison of MPC8358ECVRAGDDA by NXP Semiconductors and MPC8358EZQAGDDA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8358ECVRAGDDA MPC8358ECVRAGDDA - PowerQUICC II Pro 400MHz MPU | NXP

MPC8358ECVRAGDDA - PowerQUICC II Pro 400MHz MPU | NXP

MPC8358ECVRAGDDA ⚠ Last Time Buy
NXP Semiconductors
MPC8358EZQAGDDA MPC8358EZQAGDDA - PowerQUICC II Pro MPU 400MHz | NXP

MPC8358EZQAGDDA - PowerQUICC II Pro MPU 400MHz | NXP

MPC8358EZQAGDDA ✓ Active

Specification Comparison

Parameter MPC8358ECVRAGDDA MPC8358EZQAGDDA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy Active
Stock Status In Stock In Stock
Unit Price (USD) $139.95 $30.40
Processor Type PowerPC e300 (MPC83xx PowerQUICC II Pro) —
Core Architecture 32-bit PowerPC e300, 1 core PowerPC e300 (single core)
Core Frequency 400 MHz —
Process Technology 0.13 um CMOS —
Core Voltage 1.2 V —
I/O Voltage 1.8 V / 2.5 V / 3.3 V —
Communications Engine QUICC Engine (programmable multi-channel) —
Security Accelerator SEC (IPSec / SSL / 3DES / AES) —
Memory Controller DDR1 / DDR2, 32-bit with ECC —
Ethernet 2x Gigabit Ethernet MACs (1 GbE) Up to 3 x 10/100/1000 Mbit (via QUICC Engine)
PCI Interface 32-bit PCI 2.3 —
USB USB 2.0 Full-Speed USB 2.0 (Full/High Speed)
TDM / Serial 8x TDM / HDLC / UART channels —
ATM Support AAL2 / AAL5 —
Package 668-PBGA-PGE (29x29 mm) with exposed pad —
Operating Temperature -40 C to +105 C (industrial) 0 C to +105 C (junction)
Packaging Tray —
Lead-Free Status Lead Free —
RoHS Status Compliant —
Data Bus Width — 32-bit
Maximum Core Frequency — 400 MHz
Core Supply Voltage — 1.2 V
Package Type — 668-pin TE-PBGA-PGE (29x29 mm)
Mounting Type — Surface Mount
Memory Interface — DDR1/DDR2 with ECC
PCI — PCI 2.2, 32-bit, up to 66 MHz
Serial Protocols — ATM, HDLC, TDM, UART
Security Engine — SEC 2.0 (IPSec/SSL/3GPP acceleration)
Local Bus — 8 chip selects, SRAM/Flash/NOR
Lead-Free / RoHS — Lead-free finish; RoHS compliant
MSL Level — [DATA_NEEDED: MSL moisture sensitivity level]

Datasheets & Resources

Browse All Products Create BOM Request Quote