MPC8360ZUAGDGA vs MPC8360EZUAGDGA Comparison

Detailed side-by-side comparison of MPC8360ZUAGDGA by NXP Semiconductors and MPC8360EZUAGDGA by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC8360ZUAGDGA MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA - 400MHz PowerQUICC II Pro MPU | NXP

MPC8360ZUAGDGA ✓ Active
NXP Semiconductors
MPC8360EZUAGDGA MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA - PowerQUICC II Pro 400MHz SoC | NXP

MPC8360EZUAGDGA ✓ Active

Specification Comparison

Parameter MPC8360ZUAGDGA MPC8360EZUAGDGA
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Processor Type PowerPC e300 Microprocessor (MPC83xx PowerQUICC II Pro) —
Core Count 1 1
Architecture 32-Bit Power Architecture PowerPC e300 (Power Architecture)
Core Clock Speed 400 MHz 400 MHz
Core Voltage 1.2 V —
Package / Case 740-LBGA / 740-TBGA (37.5 x 37.5 mm) —
Packaging Tray —
Operating Temperature 0 C to 105 C 0 C to 105 C
Memory Interface DDR1/DDR2 controller with ECC DDR1 / DDR2
Ethernet 1 x 10/100/1000 (Gigabit Ethernet) 1 Gbit (10/100/1000)
PCI Interface 32-bit / 66 MHz PCI 32-bit PCI
USB Interface USB 2.0 Full-Speed —
TDM / Serial Multiple TDM channels (T1/E1/J1/HDLC/ATM) —
Revision Revision 2.x TBGA —
Encryption Non-encryption variant (no SEC 2.0) —
RoHS Status Compliant —
Lead Free Status Lead Free —
Data Bus Width — 32-bit
Supply Voltage — 1.2 V (core); 3.3 V (I/O) [DATA_NEEDED: exact supply rail breakdown]
USB — USB 2.0 full/low-speed
TDM / ATM — Yes (TDM and ATM)
Security Accelerator — SEC (crypto engine)
Package — 740-TBGA, 37.5 x 37.5 mm, 1 mm pitch
Package Height — 1.46 mm
Lead-Free / RoHS — Lead-free (per datasheet)
Mounting Type — Surface Mount
Product Family — MPC83xx PowerQUICC II Pro
Series — MPC8360E

Datasheets & Resources

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