MPC860TZQ80D4 vs MPC860DPZQ80D4 Comparison

Detailed side-by-side comparison of MPC860TZQ80D4 by NXP Semiconductors and MPC860DPZQ80D4 by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
MPC860TZQ80D4 MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP

MPC860TZQ80D4 ✗ End of Life
NXP Semiconductors
MPC860DPZQ80D4 MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 - PowerQUICC MPC860 80MHz 32-Bit MPU | NXP

MPC860DPZQ80D4 Obsolete

Specification Comparison

Parameter MPC860TZQ80D4 MPC860DPZQ80D4
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status End of Life Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $24.40 $13.85
Processor Type MPC8xx PowerQUICC, 32-Bit MPC8xx PowerQUICC, 32-bit RISC MPU
Core Architecture PowerPC 32-bit PowerPC 603-class single core
Core Frequency 80 MHz —
Bus Width 32-bit —
Operating Voltage 3.3 V —
Number of Cores 1 —
Cache Memory [DATA_NEEDED: unified cache size in KB] —
Serial Communications Controllers (SCC) 4 channels —
Serial Management Controllers (SMC) 2 channels 2 channels (UART/SPI/I2C)
SPI Controllers 2 —
I2C Interface 1 —
Package 357-BGA (PBGA), 25 x 25 mm —
Mounting Type Surface Mount Surface Mount
Operating Temperature -40 C to +95 C (industrial grade per suffix T) [DATA_NEEDED: operating temperature range]
Lead Status Contains Lead (legacy PBGA) Contains Lead
RoHS Status RoHS non-compliant (legacy PBGA, contains lead) Non-Compliant
Packaging Tray Tray
Process Technology 0.25 micron CMOS 0.32 um CMOS
Maximum Core Clock — 80 MHz
Core Voltage — 2.2 V
I/O Voltage — 3.3 V
Communications Processor Module (CPM) — Integrated 32-bit RISC CPM with SCC/SMC
Serial Communication Controllers (SCC) — Up to 4 channels (Ethernet, HDLC, UART)
Ethernet MAC — 10/100 Mbps Fast Ethernet
DMA Channels — 4 channels
Memory Controller — Integrated, up to 4 DRAM banks
Package / Case — 357-PBGA (25x25 mm)
MSL Level — [DATA_NEEDED: MSL rating]

Datasheets & Resources

Browse All Products Create BOM Request Quote