MPC885VR66 vs MPC880VR66-FR Comparison
Detailed side-by-side comparison of MPC885VR66 by NXP Semiconductors and MPC880VR66-FR by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
MPC885VR66 - 66MHz 32-Bit PowerQUICC MPU | NXP Semiconductors
MPC885VR66 ✗ End of LifeNXP Semiconductors
MPC880VR66-FR - 66MHz PowerQUICC MPU 32-Bit | NXP Semiconductors
MPC880VR66-FR NrndSpecification Comparison
| Parameter | MPC885VR66 | MPC880VR66-FR |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | End of Life | NRND |
| Manufacturer | NXP Semiconductors | NXP Semiconductors |
| Product Type | PowerQUICC Communications Processor | — |
| Processor Architecture | 32-Bit Power Architecture | — |
| Core Count | 1 core | — |
| Maximum Clock Frequency | 66 MHz | — |
| Advertised Performance | 87 MIPS | — |
| Supply Voltage | 3.3 V | [DATA_NEEDED: Vcore/Vdd range] |
| Process Technology | 0.18 um | — |
| Package | 357-PBGA (25 x 25 mm) | — |
| Package Family | 357-BBGA | — |
| Mounting Type | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Operating Temperature Range | 0°C to 95°C | — |
| Lifecycle Status | End of Life | — |
| Lead-Free Status | Lead Free | — |
| RoHS Status | RoHS Compliant | [DATA_NEEDED: per lot] |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification status] | — |
| Internal Memory Configuration | [DATA_NEEDED: cache, SRAM, and ROM configuration] | — |
| External Memory Interfaces | [DATA_NEEDED: supported external memory interfaces] | — |
| Ethernet Capability | [DATA_NEEDED: Ethernet controller configuration] | — |
| Serial Interface Configuration | [DATA_NEEDED: UART, SPI, I2C, and CAN interface details] | — |
| Series | — | PowerQUICC, MPC8xx |
| Core Processor | — | PowerPC |
| Number of Cores | — | 1 |
| Core Architecture | — | 32-Bit Power Architecture |
| Core Clock Speed | — | 66 MHz |
| Performance | — | 87 MIPS |
| Package / Case | — | 357-PBGA (25x25 mm) |
| Operating Temperature | — | 0C to +95C |
| Communications Module | — | Integrated CPM (HDLC, UART, SPI, ATM) |
| Ethernet | — | Dual Fast Ethernet MAC (10/100) |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity] |
| Suffix Code | — | -FR (tape and reel, Pb-free) |