MT40A512M16LY-062E vs K4A8G165WC-BCWE Comparison

Detailed side-by-side comparison of MT40A512M16LY-062E by Micron Technology and K4A8G165WC-BCWE by Samsung Electronics. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT40A512M16LY-062E

MT40A512M16LY-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16LY-062E βœ“ Active
Samsung Electronics
K4A8G165WC-BCWE

K4A8G165WC-BCWE - 8Gb DDR4-3200 SDRAM | Samsung | 96FBGA

K4A8G165WC-BCWE βœ“ Active

Specification Comparison

Parameter MT40A512M16LY-062E K4A8G165WC-BCWE
Brand Micron Technology Samsung Electronics
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.65 $38.00
Memory Type DDR4 SDRAM DDR4 SDRAM
Memory Size 8 Gbit β€”
Organization 512M x 16 512M x 16
Data Rate 3200 MT/s 3200 Mbps
Clock Frequency 1.6 GHz β€”
Access Time 19 ns β€”
Supply Voltage VDD/VDDQ 1.2 V +/- 60 mV β€”
Supply Voltage VPP 2.5 V (-125 mV, +250 mV) β€”
Bank Architecture 16 banks in 2 groups of 4 (x16) β€”
Refresh 8192-cycle; 64 ms at -40C to +85C, 32 ms >85C to +95C, 16 ms >95C β€”
I/O Interface 1.2 V pseudo open-drain β€”
Features Auto self-refresh, write leveling, dynamic ODT, CRC, data mask, auto precharge, async reset, ZQ calibration, on-die adjustable VREFDQ β€”
Operating Temperature -40C to +95C (IT grade) β€”
Package 96-ball FBGA (7.5 x 13.5 mm) 96-FBGA
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Density β€” 8 Gb
Supply Voltage (VDD) β€” 1.2 V
VPP Voltage β€” 2.5 V
Operating Temperature Range β€” 0Β°C to +95Β°C
CAS Latency β€” [DATA_NEEDED: CAS Latency]
Burst Length β€” 8 (BL8) / 4 (BC4)
Number of Banks β€” 16
Row Address Bits β€” 16
Column Address Bits β€” 10
Interface β€” Differential (CK, /CK)
JEDEC Standard β€” JEDEC DDR4

Datasheets & Resources

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