K4A8G165WC-BCWE - 8Gb DDR4-3200 SDRAM | Samsung | 96FBGA
MPN: K4A8G165WC-BCWE ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $47.51 | $47.51 |
| 10 | $45 | $450.00 |
| 100 | $42.5 | $4,250.00 |
| 500 | $40 | $20,000.00 |
| 1,000 | $38 | $38,000.00 |
Drop-in alternatives for K4A8G165WC-BCWE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K4A8G165WG-BCWE
✅ Drop-In✓ In Stock
$44.5 / Unit
View Datasheet →K4A8G165WC-BCRC
✅ Drop-In✓ In Stock
$23 / Unit
View Datasheet →K4A8G165WB-BCWE
✅ Drop-In✓ In Stock
$6 / Unit
View Datasheet →MT40A512M16JY-075E
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →H5AN8G6NDJR
✅ Drop-In✓ In Stock
$35 / Unit
View Datasheet →AS4C512M16D4A-62BCN
✅ Drop-In✓ In Stock
$7.2 / Unit
View Datasheet →NT5AD512M16C4-JRI
✅ Drop-In✓ In Stock
$75.58 / Unit
View Datasheet →YZ48G16V-F9HPI-M
✅ Drop-In✓ In Stock
$8.6 / Unit
View Datasheet →K4A8G165WC-BCWE Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gb |
| Organization | 512M x 16 |
| Data Rate | 3200 Mbps |
| Supply Voltage (VDD) | 1.2 V |
| VPP Voltage | 2.5 V |
| Operating Temperature Range | 0°C to +95°C |
| Package | 96-FBGA |
| Mounting Type | Surface Mount |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
| Burst Length | 8 (BL8) / 4 (BC4) |
| Number of Banks | 16 |
| Row Address Bits | 16 |
| Column Address Bits | 10 |
| Interface | Differential (CK, /CK) |
| RoHS Status | Compliant |
| JEDEC Standard | JEDEC DDR4 |
K4A8G165WC-BCWE Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | VSS — Ground |
| Pin B1 | DQ1 — Data input/output 1 |
| Pin B2 | VDDQ — Power supply for output buffers |
| Pin B3 | DQ2 — Data input/output 2 |
| Pin C1 | VSSQ — Ground for output buffers |
| Pin C2 | DQ3 — Data input/output 3 |
| Pin C3 | VDD — Power supply (1.2V) |
| Pin D1 | DQ4 — Data input/output 4 |
| Pin D2 | VSS — Ground |
| Pin D3 | DQ5 — Data input/output 5 |
| Pin E1 | VDDQ — Power supply for output buffers |
| Pin E2 | DQ6 — Data input/output 6 |
| Pin E3 | VSSQ — Ground for output buffers |
| Pin F1 | DQ7 — Data input/output 7 |
| Pin F2 | VDD — Power supply (1.2V) |
| Pin F3 | DQ8 — Data input/output 8 |
| Pin G1 | VSS — Ground |
| Pin G2 | DQ9 — Data input/output 9 |
| Pin G3 | VDDQ — Power supply for output buffers |
| Pin H1 | DQ10 — Data input/output 10 |
| Pin H2 | VSSQ — Ground for output buffers |
| Pin H3 | DQ11 — Data input/output 11 |
| Pin J1 | VDD — Power supply (1.2V) |
| Pin J2 | DQ12 — Data input/output 12 |
| Pin J3 | VSS — Ground |
| Pin K1 | DQ13 — Data input/output 13 |
| Pin K2 | VDDQ — Power supply for output buffers |
| Pin K3 | DQ14 — Data input/output 14 |
| Pin L1 | VSSQ — Ground for output buffers |
| Pin L2 | DQ15 — Data input/output 15 |
| Pin L3 | VDD — Power supply (1.2V) |
| Pin M1 | VSS — Ground |
| Pin M2 | CK — Clock input (positive) |
| Pin M3 | VDDQ — Power supply for output buffers |
| Pin N1 | /CK — Clock input (negative) |
| Pin N2 | VSSQ — Ground for output buffers |
| Pin N3 | CKE — Clock enable |
| Pin P1 | VDD — Power supply (1.2V) |
| Pin P2 | VSS — Ground |
| Pin P3 | CS_n — Chip select (active low) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K4A8G165WC-BCWE is suitable for 6 applications: High-Performance Computing, Networking Equipment, Embedded Systems, Data Center Servers, Consumer Electronics, Automotive Infotainment.
High-Performance Computing
The K4A8G165WC-BCWE provides 8Gb density and 3200 Mbps speed, making it ideal for servers and workstations that require large memory capacity and high bandwidth. Its low 1.2V operation reduces power consumption in data centers, while the 96-FBGA package enables high-density DIMM designs. The device's CRC and on-die ECC features enhance data integrity in mission-critical computing environments.
Recommended
Networking Equipment
In routers, switches, and network appliances, the K4A8G165WC-BCWE offers the speed and capacity needed for packet buffering and routing tables. Its 3200 Mbps data rate supports high-throughput data processing, while the 1.2V supply helps meet strict power budgets. The device's dynamic ODT and ZQ calibration improve signal integrity on high-speed buses, ensuring reliable operation in noisy environments.
Recommended
Embedded Systems
For embedded applications like industrial controllers and IoT gateways, the K4A8G165WC-BCWE provides a balance of density, speed, and power efficiency. Its 0°C to +95°C temperature range covers most commercial and industrial environments. The 96-FBGA package is suitable for compact PCB designs, and the device's low power consumption extends battery life in portable systems.
Recommended
Data Center Servers
The K4A8G165WC-BCWE is well-suited for data center servers that require high memory capacity and bandwidth for virtualization, databases, and cloud computing. Its 8Gb density allows for large memory modules, and the 3200 Mbps speed meets the demands of modern processors. The low operating voltage reduces total power consumption, contributing to energy-efficient data centers.
Recommended
Consumer Electronics
In high-end consumer devices like gaming consoles and set-top boxes, the K4A8G165WC-BCWE delivers the memory performance needed for smooth graphics and multitasking. Its 3200 Mbps data rate supports high-resolution video and gaming, while the 1.2V supply helps manage heat and power in compact enclosures. The device's small FBGA package enables slim device designs.
Recommended
Automotive Infotainment
The K4A8G165WC-BCWE can be used in automotive infotainment systems that require high memory bandwidth for navigation, multimedia, and driver assistance features. Its 0°C to +95°C temperature range is suitable for cabin environments, though not for under-hood applications. The device's reliability features like CRC and ODT ensure stable operation in the electrically noisy automotive environment.
Recommended
Recommended Products Summary
Engineering reference data for K4A8G165WC-BCWE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K4A8G165WG-BCWE | MT40A512M16JY-075E | H5AN8G6NDJR |
|---|---|---|---|---|
| Package | 96-FBGA | 96-FBGA | 96-FBGA | 96-FBGA |
| Brand | Samsung Electronics | Samsung Electronics | Micron Technology | SK Hynix |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 Mbps | 3200 Mbps | 3200 Mbps | 3200 Mbps |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Die Revision | C-die | G-die | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- C-die revision with wide temperature range (vs K4A8G165WG-BCWE)
- Samsung's proven reliability and performance (vs MT40A512M16JY-075E)
- Availability and ecosystem support (vs H5AN8G6NDJR)
Design Notes
Ensure stable 1.2V VDD and 2.5V VPP supplies with adequate decoupling. Place 0.1uF and 1uF ceramic capacitors close to each power pin to minimize noise and voltage droop during high-speed switching. Follow the JEDEC DDR4 power distribution guidelines for optimal performance.
Route high-speed DQ, DQS, and clock signals with controlled impedance (typically 40-50 ohms) and matched trace lengths to ensure signal integrity. Use ground planes and minimize vias on critical signals. Refer to the Samsung layout guidelines in the datasheet for recommended routing and spacing.
The K4A8G165WC-BCWE operates up to +95°C, but ensure adequate airflow or heatsinking in high-power systems. The 96-FBGA package has a thermal resistance that should be considered; use thermal vias under the package to improve heat dissipation. Monitor junction temperature to avoid exceeding the maximum rating.
Compliance Information
RoHS compliance is indicated by Samsung's product page. Other compliance details are not explicitly stated in the provided data.
