MT41K256M16RE-125:D vs H5TC4G63AFR-PBI Comparison

Detailed side-by-side comparison of MT41K256M16RE-125:D by Micron Technology and H5TC4G63AFR-PBI by SK hynix. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Micron Technology
MT41K256M16RE-125:D MT41K256M16RE-125:D - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16RE-125:D - 4Gb DDR3L SDRAM 256Mx16 | Micron

MT41K256M16RE-125:D ✓ Active
SK hynix
H5TC4G63AFR-PBI H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

H5TC4G63AFR-PBI - 4Gb DDR3L SDRAM 256Mx16 | SK Hynix

H5TC4G63AFR-PBI Obsolete

Specification Comparison

Parameter MT41K256M16RE-125:D H5TC4G63AFR-PBI
Brand Micron Technology SK hynix
Category Memory ICs Memory ICs
Lifecycle Status Active Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $4.19 $6.50
Memory Type DDR3L SDRAM DDR3L SDRAM
Density 4 Gb —
Organization 256M x 16 256M x 16
Supply Voltage 1.35 V 1.35 V
Data Rate 1600 MT/s DDR3-1600 (PC3L-12800)
CAS Latency 11 Programmable
Package FBGA-96 (9x14 mm) 96-ball FBGA (TFBGA, BGA96, 9x16, 32)
Operating Temperature 0C to +95C (TC) —
RoHS Compliant —
Lead-Free Yes —
Burst Length 8, 4 8 (BL8)
On-Die Termination Yes —
Auto-Refresh Yes —
Self-Refresh Yes —
Ball Pitch 0.8 mm —
Total Memory Size — 4 Gb
Number of Banks — 8
On-Die Termination (ODT) — Yes
Refresh Period — 7.8 us at 85°C
Operating Temperature Range — -40°C to +95°C
Mounting Type — Surface Mount
Number of Terminals — 96
RoHS Status — Compliant

Datasheets & Resources

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