P1022NXN2LFB vs P1021NXE2HFB Comparison

Detailed side-by-side comparison of P1022NXN2LFB by NXP Semiconductors and P1021NXE2HFB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
P1022NXN2LFB P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB - QorIQ Dual-Core 1.067 GHz SoC | NXP | Networking

P1022NXN2LFB ⚠ Last Time Buy
NXP Semiconductors
P1021NXE2HFB P1021NXE2HFB - QorIQ Dual-Core 800MHz SoC | NXP

P1021NXE2HFB - QorIQ Dual-Core 800MHz SoC | NXP

P1021NXE2HFB ✗ End of Life

Specification Comparison

Parameter P1022NXN2LFB P1021NXE2HFB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Last Time Buy End of Life
Stock Status In Stock In Stock
Unit Price (USD) $78.40 $112.80
Architecture Power Architecture e500 dual-core (RISC, 32-bit) —
Clock Speed (Core) 1.067 GHz —
Platform Version 1067/533/667 ET NE r1.1 —
Core Count 2 —
Package Type TEPBGA-689 (Plastic, halogen-free, RoHS-compliant) —
Package Dimensions 31 x 31 mm, 2.23 mm height —
Pin Count 689 —
Operating Temperature -40 °C to +125 °C (industrial) -40C to +125C (industrial/extended)
Supply Voltage 3.13 V to 3.47 V —
Memory Controller DDR2/DDR3 with ECC support, up to 32-bit DDR2/DDR3 with ECC
Ethernet MACs 3 x 10/100/1000 Mbps Gigabit —
PCIe Interfaces 3 x PCIe Gen1 —
USB USB 2.0 host/device USB 2.0
Display Controller 32-bit LCD controller —
Security Engine Integrated (symmetric/asymmetric crypto acceleration) —
RoHS Compliance Yes (halogen-free) —
Mounting Type Surface Mount (BGA, requires thermal via array under die) —
Part Number — P1021NXE2HFB
Manufacturer — NXP Semiconductors
Series — QorIQ P1
Core Architecture — PowerPC e500v2
Number of Cores — 2
Core Frequency (Max) — 800 MHz
Data Bus Width — 32-bit
Ethernet — 3x Gigabit Ethernet (GbE)
PCIe — Yes
Security Engine (SEC) — Yes (hardware-accelerated)
QUICC Engine (QE) — Yes, revision r1.1
Package — 689-TEPBGA II (31x31 mm)
Process Technology — 45 nm
Speed Bin — 800/400/667 MHz
Lifecycle Status — End of Life (per NXP product page)
RoHS — Compliant (per distributor listings)

Datasheets & Resources

Browse All Products Create BOM Request Quote