P3041NXN1NNB vs P3041NXN1MMB Comparison
Detailed side-by-side comparison of P3041NXN1NNB by NXP Semiconductors and P3041NXN1MMB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
NXP Semiconductors
P3041NXN1NNB QorIQ P3041 Quad-Core e500mc MPU 1.333GHz | NXP
P3041NXN1NNB ✓ ActiveNXP Semiconductors
P3041NXN1MMB - QorIQ P3 Quad-Core 1.2GHz MPU | NXP Semiconductors
P3041NXN1MMB ✓ ActiveSpecification Comparison
| Parameter | P3041NXN1NNB | P3041NXN1MMB |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Category | Microcontrollers | Microcontrollers |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $128.50 | $215.00 |
| Core Architecture | PowerPC e500mc | PowerPC e500mc |
| Number of Cores | 4 | 4 |
| Maximum Core Frequency | 1.333 GHz | 1.2 GHz |
| Silicon Revision | 1.1 | — |
| L2 Cache (per core) | 256 KB | — |
| Platform Cache | 2 MB | — |
| Memory Controller | Dual DDR3 with ECC | DDR3 / DDR3L with ECC (per product brief) |
| 10 Gigabit Ethernet | 3 XAUI interfaces | — |
| Gigabit Ethernet | 8 controllers | — |
| PCI Express | 4 x PCIe 2.0 controllers | — |
| Serial RapidIO | 1.0 Serial RapidIO 2.1 interface | — |
| Security Engine (SEC) | Not included (no SEC variant) | — |
| Operating Temperature | -40C to +105C (extended) | — |
| Package | 1295-ball FCBGA, 37.5 mm x 37.5 mm | 1295-FCPBGA (FCBGA, 37.5x37.5 mm) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Data Bus Width | — | 32-bit |
| Family | — | QorIQ P3 |
| Encryption Acceleration | — | NonENC (no SEC engine) |
| Product Variant | — | r1.1 silicon revision |
| Operating Temperature Range | — | -40C to +105C |
| High-Speed I/O | — | Multiple SerDes lanes for 10 GbE, GbE, PCIe (per family) |
| Process Technology | — | [DATA_NEEDED: process node] |
| Supply Voltage (Core) | — | [DATA_NEEDED: Vdd_core] |
| RoHS Status | — | Compliant (BGA solder-ball lead-free per NXP product family) |