S9S08QD4J2MSCR vs MC9S08QD2CSC Comparison

Detailed side-by-side comparison of S9S08QD4J2MSCR by NXP Semiconductors and MC9S08QD2CSC by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
S9S08QD4J2MSCR S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR - 8-bit 16MHz 4KB Flash MCU | NXP

S9S08QD4J2MSCR ✓ Active
NXP Semiconductors
MC9S08QD2CSC MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)

MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)

MC9S08QD2CSC ✓ Active

Specification Comparison

Parameter S9S08QD4J2MSCR MC9S08QD2CSC
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status — In Stock
Unit Price (USD) — $2.05
Core HCS08 —
Instruction Set Architecture CISC (68 HC08 with added BGND) CISC
Core Width 8-bit —
Maximum CPU Frequency 16 MHz —
Program Memory Type Flash Flash
Program Memory Size 4 KB (4K x 8) 2KB (2K x 8)
Supply Voltage 2.7 V to 5.5 V 3.3 V / 5 V
Operating Temperature -40 C to +125 C [DATA_NEEDED: operating temperature range]
Package 8-SOIC (0.154 inch, 3.90 mm width) —
Mounting Type Surface Mount Surface Mount
Packaging Tape & Reel (TR) Tape & Reel
I/O Pins 4 —
ADC 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI —
Timers TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) —
Debug Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints —
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Core Processor — S08
Core Size — 8-Bit
Speed (Bus Frequency) — 16 MHz
RAM Size — 128 x 8
Number of I/O — 4
Oscillator Type — Internal
Package / Case — 8-SOIC (0.154 in, 3.90 mm Width)
Technology — CMOS
Product Series — S08QD (9S08QD4 SERIES per distributor listing)

Datasheets & Resources

Browse All Products Create BOM Request Quote