VSC8484XJP vs VSC8484YJP Comparison
Detailed side-by-side comparison of VSC8484XJP by Microchip Technology and VSC8484YJP by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
VSC8484XJP - Quad-Channel XAUI Transceiver | Microchip Technology
VSC8484XJP ✓ ActiveMicrochip Technology
VSC8484YJP - 10GbE Quad XAUI-to-Serial Transceiver BGA-324 | Microchip
VSC8484YJP NrndSpecification Comparison
| Parameter | VSC8484XJP | VSC8484YJP |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | RF Transceivers | Interface ICs |
| Lifecycle Status | Active | NRND |
| Product Type | Quad-channel XAUI-to-serial transceiver | 10 GbE Quad Channel XAUI-to-Serial Transceiver PHY |
| Channel Count | 4 channels | — |
| Power Dissipation | 1 W per channel | ~1 W per channel (4 W typical, 4 channels) |
| Data-Rate Class | 10G platforms | — |
| Input Interface | XAUI | — |
| Output Interface | SFP+, KR, and compatible serial links | — |
| Dispersion Compensation | Electronic dispersion compensation (EDC) | — |
| Target Network Domains | WAN, LAN, and backplane | — |
| Primary Application | High-density server connectivity | — |
| Port-Density Objective | Next-generation 10G platforms | — |
| Package | [DATA_NEEDED: package type and dimensions] | 324-ball PBGA (BGA-324), 18.6 mm × 18.6 mm |
| Pin Count | [DATA_NEEDED: pin count] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Supply Voltage | [DATA_NEEDED: supply voltage] | — |
| Maximum Data Rate | [DATA_NEEDED: maximum data rate] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Number of Channels | — | 4 (independent 10G PHYs) |
| Line-Side Interface | — | XFI / SFI (per channel) |
| System-Side Interface | — | XAUI (4 lanes, 3.125 Gbps each) |
| Supported Data Rates | — | 10 Gbps line-side, 4 × 3.125 Gbps XAUI |
| Backplane Support | — | 10GBASE-KR with integrated EDC (FR4 reach extension) |
| EDC Engine | — | Microsemi proprietary electronic dispersion compensation |
| Package Code | — | S-PBGA-B324 |
| Mounting Type | — | Surface Mount |
| Operating Temperature (max) | — | 105 °C (junction, per datasheet) |
| Management Interface | — | MDIO / I2C |
| Compliance | — | IEEE 802.3ae (10GBASE-R family), 10GFC |
| Lead-Free / RoHS | — | Lead-free (PBGA, RoHS-compliant) |
| Lifecycle Status | — | Not Recommended for New Designs (NRND) |
| Original Manufacturer | — | Microsemi (now Microchip Technology) |