W634GU6RB-09 vs MT40A512M16LY-062E Comparison

Detailed side-by-side comparison of W634GU6RB-09 by Winbond and MT40A512M16LY-062E by Micron Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Winbond
W634GU6RB-09 W634GU6RB-09 - 4Gb DDR3L SDRAM 1066MHz | Winbond

W634GU6RB-09 - 4Gb DDR3L SDRAM 1066MHz | Winbond

W634GU6RB-09 βœ“ Active
Micron Technology
MT40A512M16LY-062E

MT40A512M16LY-062E - 8Gb DDR4 SDRAM 3200MT/s | Micron

MT40A512M16LY-062E βœ“ Active

Specification Comparison

Parameter W634GU6RB-09 MT40A512M16LY-062E
Brand Winbond Micron Technology
Category Memory ICs Memory ICs
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.69 $6.65
Memory Type DDR3L SDRAM DDR4 SDRAM
Memory Size 4Gbit (512M x 8) 8 Gbit
Supply Voltage 1.35V β€”
Clock Frequency 1.067 GHz 1.6 GHz
Data Rate 2133 Mbps 3200 MT/s
Access Time 20 ns 19 ns
Interface Parallel β€”
Package 96-VFBGA (7.5x13 mm) 96-ball FBGA (7.5 x 13.5 mm)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40Β°C to 95Β°C -40C to +95C (IT grade)
RoHS Status Compliant Compliant
Halogen Free Yes β€”
Organization 512M x 8 512M x 16
Terminal Pitch [DATA_NEEDED: Terminal Pitch] β€”
Number of Pins 96 β€”
Supply Voltage VDD/VDDQ β€” 1.2 V +/- 60 mV
Supply Voltage VPP β€” 2.5 V (-125 mV, +250 mV)
Bank Architecture β€” 16 banks in 2 groups of 4 (x16)
Refresh β€” 8192-cycle; 64 ms at -40C to +85C, 32 ms >85C to +95C, 16 ms >95C
I/O Interface β€” 1.2 V pseudo open-drain
Features β€” Auto self-refresh, write leveling, dynamic ODT, CRC, data mask, auto precharge, async reset, ZQ calibration, on-die adjustable VREFDQ

Datasheets & Resources

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