XC3S200-4TQ144C vs XC3S200-4TQ144I Comparison

Detailed side-by-side comparison of XC3S200-4TQ144C by Xilinx and XC3S200-4TQ144I by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Xilinx
XC3S200-4TQ144C XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx

XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx

XC3S200-4TQ144C Obsolete

Specification Comparison

Parameter XC3S200-4TQ144C XC3S200-4TQ144I
Brand Xilinx AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Device Type Spartan-3 field-programmable gate array (FPGA) Spartan-3 field-programmable gate array (FPGA)
System Gates 200,000 gates 200,000 gates
Logic Cells 4,320 logic cells —
Adaptive Logic Modules 192 ALMs 1,920 ALMs
User I/O 97 I/Os 97 I/O pins
Core Supply Voltage 1.2 V 1.14 V to 1.26 V
Maximum Frequency 725 MHz —
Process Technology 90 nm 90 nm
Package 144-pin TQFP 144-pin TQFP
Operating Temperature 0°C to 85°C -40°C to +100°C junction temperature
Speed Grade -4 -4
Programmable Logic Type Field-programmable gate array —
Mounting Type Surface mount Surface mount
Lead-Free Status Lead-free package marking reported in verified listing Lead-free
RoHS Compliance [DATA_NEEDED: RoHS compliance status] —
REACH Compliance [DATA_NEEDED: REACH compliance status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification status] —
Pin Configuration [DATA_NEEDED: complete 144-pin configuration and I/O assignment table] —
Logic Elements — 4,320 logic elements
Logic Array Blocks — 480 LABs/CLBs
Embedded RAM — 221,184 bits
Maximum Clock Frequency — 630 MHz
Programming Technology — In-system programmable
Configuration Method — [DATA_NEEDED: configuration method]
I/O Standard — [DATA_NEEDED: supported I/O standards]

Datasheets & Resources

Browse All Products Create BOM Request Quote