XC3S200-5FTG256C vs XC3S200-4FT256C Comparison

Detailed side-by-side comparison of XC3S200-5FTG256C by AMD and XC3S200-4FT256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S200-5FTG256C XC3S200-4FT256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status End of Life Active
Device Type FPGA FPGA
FPGA Family Spartan-3 Spartan-3
System Gates 200000 gates 200000
Logic Cells / Logic Blocks 4320 logic cells —
Maximum Frequency 725 MHz —
Core Supply Voltage 1.2 V —
Process Technology 90 nm 90 nm
Package 256-LBGA 256-LBGA
Terminals 256 balls —
Package Type Lead Free —
Operating Temperature 0 to 85 C 0°C to 85°C
Mounting Type Surface Mount —
Device Category Programmable Logic Devices, Field Programmable Gate Arrays —
Speed Grade -5 -4
Temperature Grade Commercial Commercial
Configuration Memory Support [DATA_NEEDED: configuration PROM interface and supported PROM devices] —
Block RAM and DSP Resources [DATA_NEEDED: block RAM and dedicated multiplier counts] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Logic Cells — 4320
Configurable Logic Blocks — 480
Maximum Clock Frequency — 630 MHz
Nominal Core Supply Voltage — 1.2 V
Maximum Supply Voltage — 1.26 V
Number of Terminals — 256
Terminal Form — Ball
Package Shape — Square
Lead-Free Status — Lead free
Typical Application — Cost-sensitive high-performance programmable logic
I/O Standard Support — [DATA_NEEDED: supported I/O standards]
Core Current — [DATA_NEEDED: core current]
Configuration Memory — [DATA_NEEDED: configuration memory]

Datasheets & Resources

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