XC3S200-5FTG256C vs XC3S200-4FTG256C Comparison
Detailed side-by-side comparison of XC3S200-5FTG256C by AMD and XC3S200-4FTG256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | XC3S200-5FTG256C | XC3S200-4FTG256C |
|---|---|---|
| Brand | AMD | AMD |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | End of Life | Obsolete |
| Device Type | FPGA | Spartan-3 Field Programmable Gate Array |
| FPGA Family | Spartan-3 | — |
| System Gates | 200000 gates | 200,000 gates |
| Logic Cells / Logic Blocks | 4320 logic cells | — |
| Maximum Frequency | 725 MHz | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm |
| Package | 256-LBGA | — |
| Terminals | 256 balls | — |
| Package Type | Lead Free | 256-LBGA |
| Operating Temperature | 0 to 85 C | 0 °C to 85 °C |
| Mounting Type | Surface Mount | Surface Mount |
| Device Category | Programmable Logic Devices, Field Programmable Gate Arrays | — |
| Speed Grade | -5 | -4 |
| Temperature Grade | Commercial | — |
| Configuration Memory Support | [DATA_NEEDED: configuration PROM interface and supported PROM devices] | — |
| Block RAM and DSP Resources | [DATA_NEEDED: block RAM and dedicated multiplier counts] | — |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Logic Cells | — | 4,320 cells |
| Maximum Clock Frequency | — | 630 MHz |
| Number of Package Balls | — | 256 balls |
| Device Family | — | Spartan-3 |
| Programmable Logic Type | — | FPGA |
| Lead-Free Status | — | Lead Free |
| I/O Count | — | [DATA_NEEDED: I/O count] |
| Block RAM | — | [DATA_NEEDED: block RAM capacity] |
| DSP Resources | — | [DATA_NEEDED: DSP block count] |
| RoHS Compliance | — | [DATA_NEEDED: RoHS compliance status] |