XC3S200-5FTG256C vs XC3S200-5FT256C Comparison

Detailed side-by-side comparison of XC3S200-5FTG256C by AMD and XC3S200-5FT256C by AMD. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S200-5FTG256C XC3S200-5FT256C
Brand AMD AMD
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status End of Life Obsolete
Device Type FPGA Field-Programmable Gate Array (FPGA)
FPGA Family Spartan-3 Spartan-3
System Gates 200000 gates 200,000 gates
Logic Cells / Logic Blocks 4320 logic cells —
Maximum Frequency 725 MHz —
Core Supply Voltage 1.2 V 1.2 V
Process Technology 90 nm —
Package 256-LBGA —
Terminals 256 balls —
Package Type Lead Free 256-LBGA
Operating Temperature 0 to 85 C 0°C to 85°C
Mounting Type Surface Mount Surface mount
Device Category Programmable Logic Devices, Field Programmable Gate Arrays —
Speed Grade -5 —
Temperature Grade Commercial —
Configuration Memory Support [DATA_NEEDED: configuration PROM interface and supported PROM devices] —
Block RAM and DSP Resources [DATA_NEEDED: block RAM and dedicated multiplier counts] —
I/O Standards [DATA_NEEDED: supported I/O standards] —
Alternate System Gate Listing — 50,000 gates
Logic Cells — 192 logic cells
Logic Blocks — 192 logic blocks
Performance Grade — -5
Package Shape — Square
Terminal Type — Ball
Number of Terminals — 256
Lead-Free Status — Lead-free
Operating Voltage Range — [DATA_NEEDED: operating voltage range]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Memory Resources — [DATA_NEEDED: block RAM and distributed RAM resources]
Configuration Method — [DATA_NEEDED: supported configuration modes]
RoHS Status — [DATA_NEEDED: RoHS compliance status]
REACH Status — [DATA_NEEDED: REACH compliance status]

Datasheets & Resources

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