XC3S200A-4FT256I vs XC3S200A-4FTG256I Comparison

Detailed side-by-side comparison of XC3S200A-4FT256I by AMD and XC3S200A-4FTG256I by Xilinx. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter XC3S200A-4FT256I XC3S200A-4FTG256I
Brand AMD Xilinx
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Active
Device Type Spartan-3A Field-Programmable Gate Array (FPGA) —
Configurable Logic Cells 4,032 cells —
Equivalent Logic Gates 200,000 gates —
User I/O Count 195 I/Os —
RAM Capacity 294,912 bits —
Maximum Device Speed 667 MHz —
Core Supply Voltage 1.2 V —
Fabrication Technology 90 nm CMOS —
FPGA Family Spartan-3A —
Package 256-ball FT256 BGA 256-ball FTBGA (FTG256), 17x17 mm, 1.0 mm pitch
Package Code FT256 —
Package Type LBGA —
Terminal Count 256 balls —
Package Shape Square —
Terminal Form Ball —
Temperature Grade Industrial —
Mounting Style Surface Mount —
Programming Interface [DATA_NEEDED: programming interface] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
RoHS Compliance unknown —
REACH Compliance unknown —
Family — Spartan-3A
System Gates — 200,000
Logic Cells — 4,032
Configurable Logic Blocks (CLBs) — 448
Slices — 1,792
Distributed RAM — 48 Kbits
Block RAM — 288 Kbits
User I/Os — 195
Maximum Operating Frequency — 667 MHz
Speed Grade — -4
Process Technology — 90 nm CMOS
Core Voltage — 1.2 V
Multipliers (18x18) — 16 dedicated
DCMs — 4
Operating Temperature — -40C to +100C (industrial)
RoHS Status — Lead-free / RoHS compliant

Datasheets & Resources

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